Micron Technology is a world leader in innovating memory and storage solutions. The Advanced Packaging Technology Development team focuses on pushing the boundaries of 3D memory, taking ideas from early experiments to factory-ready processes through hands-on work with materials, tools, and industry partners. This senior Process Engineering Technical Leader role is specifically focused on chip-to-wafer and hybrid bonding. The successful candidate will lead the development and scale-up of bonding processes to enable high-performance 3D memory products like HBM and 3DS DRAM. The work will encompass early pathfinding through high-volume manufacturing, with a direct impact on reliability, performance, and cost.
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Job Type
Full-time
Career Level
Senior
Number of Employees
5,001-10,000 employees