SMT Programmer / CAM Engineer

Celestica International LP•Plano, TX

35d•Onsite

About The Position

This position is located in our Plano Facility. The Senior Lead Engineer, Manufacturing Process is responsible for designing, developing, deploying and optimizing processes for manufacturing to achieve quality cost and delivery goals for Celestica and its customers products.

Requirements

4 to 6 years in a similar role or industry.
Bachelor degree or consideration of an equivalent combination of education and experience.
NPI-PCBA: ESD
NPI-PCBA: Component Prep
NPI-PCBA: Laser marking
NPI-PCBA: Solder Paste Deposition (screening / jetting) / Stencil Design
NPI-PCBA: SMT component placement
NPI-PCBA: Reflow
NPI-PCBA: Tooling design
NPI-PCBA: PTH soldering
NPI-PCBA: PTH manual assembly
NPI-PCBA: Press Fit assembly
NPI-PCBA: Depanelization
NPI-PCBA: Board level mechanical assembly
NPI-PCBA: wire harness assembly
NPI-PCBA: wire prep
NPI-PCBA: SMT data analytics
NPI-PCBA: SMT / PTH manual / automated rework
NPI-PCBA: cleaning processes
NPI-PCBA: coating / potting underfill / ruggedization processes
NPI-PCBA: pack & ship
NPI-PCBA: optical component assembly
NPI-PCBA: fiber / tray handling processes
NPI-PCBA: fiber splicing
NPI-PCBA: IPC-610
NPI-PCBA: quality data (KPI)
NPI-PCBA: Engineering Control & System Tools (ODC/SCE)
NPI-PCBA: Manufacturing Operational management
NPI-PCBA: DFM - Mfg
NPI-PCBA: DFA
NPI-PCBA: DFR
NPI-PCBA: Customer specific processes
NPI-PCBA: structural test and inspection processes
NPI-PCBA: machining
NPI-PCBA: welding
NPI-PCBA: CNC programming
NPI-PCBA: secondary processes
NPI-PCBA: sheet metal
NPI-PCBA: DFAA
DFX: ESD Controls
DFX: Component Prep
DFX: Component Module Programming
DFX: Laser Marking
DFX: Screening
DFX: Stencil Design
DFX: Solder Paste Dispense / Jetting
DFX: SMT Programming
DFX: SMT Placement
DFX: SMT Reflow
DFX: Sweat Soldering
DFX: Flex Board Assembly / Handling
DFX: Pallet Design
DFX: PTH Soldering
DFX: Robot Soldering
DFX: PTH manual Assembly
DFX: PTH Auto Assembly
DFX: Pressfit
DFX: Depanelization
DFX: Mechanical Assemb;y (TIMs, Heatsinks, PCBA, Hotbar, Ultrasonic Welding)
DFX: Wire Harness Assembly
DFX: Wire Prep
DFX: System Assembly
DFX: SMT and PTH Rework
DFX: Cleaning Processes
DFX: Conformal Coating
DFX: Underfills / Edgebonding / Potting
DFX: Pack and Ship
DFX: Chassis Assembly (fluidics, electrical enclosure, cable routing)
DFX: Sheet Metal
DFX: Machining
DFX: Welding
DFX: Structural Test (API, AOI, AXI, ICT, Flying Probe)
FA LAB: ESD Controls
FA LAB: Solder Metallurgy
FA LAB: Strain Gauge Analysis
FA LAB: SIR Testing
FA LAB: Solder Joint Reliability Modeling
FA LAB: Sample Prep (Grind and Polish)
FA LAB: Dye & Pry
FA LAB: CMM/VMM
FA LAB: Lab X-Ray
FA LAB: Pull/Bend Testing
FA LAB: Vibration Testing
FA LAB: Drop Testing
FA LAB: TDR
FA LAB: XRF
FA LAB: SEM
FA LAB: FTIR
FA LAB: IC
FA LAB: Solderability Testing
FA LAB: Thermal Analysis
FA LAB: HALT/HASS
FA LAB: TH&B
FA LAB: Thermal Shock
FA LAB: ATC
OPTICAL & XRAY INSPECTION: ESD Controls
OPTICAL & XRAY INSPECTION: Auto Wire Prep
OPTICAL & XRAY INSPECTION: SMT Data Analytics
OPTICAL & XRAY INSPECTION: API
OPTICAL & XRAY INSPECTION: AOI (PCBA)
OPTICAL & XRAY INSPECTION: AXI (PCBA)
OPTICAL & XRAY INSPECTION: AOI (System)
OPTICAL & XRAY INSPECTION: Test Strategy Creation
OPTICAL & XRAY INSPECTION: IPC-610
OPTICAL & XRAY INSPECTION: Quality Dat (KPI)
OPTICAL & XRAY INSPECTION: DFM - Manufacturing
OPTICAL & XRAY INSPECTION: DFA - Assembly
OPTICAL & XRAY INSPECTION: DFT / Physical Test
OPTICAL & XRAY INSPECTION: DFT - Electrical Test
MACHINING & OTHER: ESD Controls
MACHINING & OTHER: Pack & Ship
MACHINING & OTHER: CNC programming
MACHINING & OTHER: Secondary Processing
MACHINING & OTHER: Sheet Metal
MACHINING & OTHER: Machining
MACHINING & OTHER: Welding
MACHINING & OTHER: DFM - Manufacturing
MECHANICAL & SYSTEMS ASSEMBLY: ESD Controls
MECHANICAL & SYSTEMS ASSEMBLY: Wire Harness Assembly
MECHANICAL & SYSTEMS ASSEMBLY: Auto Wire Prep
MECHANICAL & SYSTEMS ASSEMBLY: Mechanical Assembly - System Build
MECHANICAL & SYSTEMS ASSEMBLY: OEE / Industrial Engineering
MECHANICAL & SYSTEMS ASSEMBLY: Pack & Ship
MECHANICAL & SYSTEMS ASSEMBLY: Vacuum System
MECHANICAL & SYSTEMS ASSEMBLY: Fluidics
MECHANICAL & SYSTEMS ASSEMBLY: Electrical Enclosure
MECHANICAL & SYSTEMS ASSEMBLY: Cable Routing
MECHANICAL & SYSTEMS ASSEMBLY: Electrical - Automation
MECHANICAL & SYSTEMS ASSEMBLY: Mechanical - Automation
MECHANICAL & SYSTEMS ASSEMBLY: Machine Vision
MECHANICAL & SYSTEMS ASSEMBLY: IPC-610
MECHANICAL & SYSTEMS ASSEMBLY: Engineering Controls
MECHANICAL & SYSTEMS ASSEMBLY: Quality Data (KPI)
MECHANICAL & SYSTEMS ASSEMBLY: Manufacturing Operational Management
MECHANICAL & SYSTEMS ASSEMBLY: DFM - Manufacturing
MECHANICAL & SYSTEMS ASSEMBLY: DFA - Assembly
MECHANICAL & SYSTEMS ASSEMBLY: DFAA - Automated Assembly
MECHANICAL & SYSTEMS ASSEMBLY: DFT - Physical Test
PCBA ASSEMBLY: ESD
PCBA ASSEMBLY: Component Prep
PCBA ASSEMBLY: Laser marking
PCBA ASSEMBLY: Solder Paste Deposition (screening / jetting) / Stencil Design
PCBA ASSEMBLY: SMT component placement
PCBA ASSEMBLY: Reflow
PCBA ASSEMBLY: Tooling design
PCBA ASSEMBLY: PTH soldering
PCBA ASSEMBLY: PTH manual assembly
PCBA ASSEMBLY: Press Fit assembly
PCBA ASSEMBLY: Depanelization
PCBA ASSEMBLY: Board level mechanical assembly
PCBA ASSEMBLY: wire harness assembly
PCBA ASSEMBLY: wire prep
PCBA ASSEMBLY: SMT data analytics
PCBA ASSEMBLY: SMT / PTH manual / automated rework
PCBA ASSEMBLY: cleaning processes
PCBA ASSEMBLY: coating / potting underfill / ruggedization processes
PCBA ASSEMBLY: pack & ship
PCBA ASSEMBLY: optical component assembly
PCBA ASSEMBLY: fiber / tray handling processes
PCBA ASSEMBLY: fiber splicing
PCBA ASSEMBLY: IPC-610
PCBA ASSEMBLY: quality data (KPI)
PCBA ASSEMBLY: Manufacturing Operational management
PCBA ASSEMBLY: DFM - Mfg
PCBA ASSEMBLY: DFA
PCBA ASSEMBLY: DFR
PCBA ASSEMBLY: Customer specific processes
MICROELECTRONICS: ESD Controls
MICROELECTRONICS: Wafer Thinning
MICROELECTRONICS: Wafer Singulation
MICROELECTRONICS: Edge Polishing
MICROELECTRONICS: Optical Coatings
MICROELECTRONICS: Die Bonding
MICROELECTRONICS: Vacuum Reflow
MICROELECTRONICS: Flip Chip Bonding
MICROELECTRONICS: Underfill
MICROELECTRONICS: Active Alignment
MICROELECTRONICS: Plasma Cleaning
MICROELECTRONICS: Wire Bonding
MICROELECTRONICS: Encapsulation
MICROELECTRONICS: Sealing
MICROELECTRONICS: Leak Testing
MICROELECTRONICS: Interconnect Formation

Responsibilities

Responsible for understanding and implementing the customer’s technical roadmap and related process development projects.
Lead and implement the development and release of the full manufacturing process for new customer products.
Understand and provide feedback on customer’s technical requirements to team members and management
Responsible for developing and implementing costed and optimized feedback using Design for manufacturability (DFX) tools and processes, with the goal of reducing manufacturing cost and improving quality and reliability of product.
Develop, plan and lead the assessment of the capability of process applications using Design of Experiments.
Devise process controls and data collection strategies and evaluate complex data to assist with reporting yield, reliability and diagnoses to root causes failures impacting product quality.
Ensure accurate and timely communication to management on critical technical and business issues.

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