Silicon photonics and heterogenous integration R&D engineer

Coherent

28d • Onsite

About The Position

This role focuses on the research and development of silicon photonics and heterogeneously integrated devices and circuits for advanced platforms like datacom and optical I/O. The engineer will be responsible for modeling, design, and verification of these components, ensuring compatibility with fabrication processes and evaluating integration options to enhance performance and functionality. The position involves shaping early-stage concepts, contributing to technology roadmaps, and coordinating cross-functional execution with various internal and external teams. Communication of technical findings and recommendations to stakeholders is a key aspect of the role.

Requirements

• Ph.D. in Electrical Engineering, Applied Physics, Photonics, Materials Science, or related field.
• >7 years of experience in silicon photonics design, integrated photonics R&D, SiP fabrication-aware design, prototype development, device verification, or related semiconductor photonics work.
• Hands-on SiP fabrication experience or close collaboration with SiP fabrication teams is required, with sufficient process understanding to design realistic prototype trials and interpret results.
• Experience connecting design choices to optical, electrical, thermal, mechanical, reliability, process-integration, and packaging outcomes for photonic or optoelectronic devices.
• Experience with simulation, data analysis, DOE, documentation, and R&D decision support using Python, Lumerical, COMSOL, JMP, Excel, or equivalent.
• Strong foundation in silicon photonics design, device physics, test vehicles, materials interfaces, PDK-based design, and process-integration constraints.
• Structured problem-solving ability and comfort defining technical direction from trade-offs, incomplete data, and early prototype results.
• Collaborative style and ability to influence across design, process integration, packaging, reliability, business groups, suppliers, and external partners.
• Clear written and verbal communication with senior technical, product, manufacturing, and business audiences.

Nice To Haves

• Experience with heterogeneous integration of non-silicon materials on silicon, including wafer bonding, die bonding, transfer printing, direct bonding, adhesive bonding, or thin-film transfer.
• Packaging experience is a plus, including co-packaged optics, optical coupling, fiber attach, PIC / EIC integration, OSAT engagement, or prototype assembly.
• Familiarity with PDKs from multiple fabs, silicon photonics tapeout flows, and layout reviews is valuable.
• Experience with silicon photonics tapeouts is a valuable strength for this role.

Responsibilities

• Develop silicon photonics and heterogeneously integrated device and circuit concepts for datacom, optical I/O, and related platforms.
• Model optical, electrical, thermal, and link-level behavior to guide design choices before prototype builds.
• Define prototype verification objectives and use early trial results to refine designs.
• Apply process-integration awareness to keep designs compatible with fabrication, test, and metrology constraints.
• Evaluate heterogeneous integration options when they may improve silicon photonics performance or functionality.
• Shape early-stage concepts, feasibility objectives, risk-reduction plans, and prototype approaches for CTO Office topics, including possible architectures such as CPO and optical I/O.
• Lead technical evaluations, modeling, design reviews, and trade-off studies with internal or external contributors.
• Develop recommendations on performance, manufacturability, integration path, scalability, reliability, and transition readiness.
• Contribute technical input to roadmap discussions in optical interconnect, CPO / optical I/O, AI/HPC infrastructure, silicon photonics, detector technologies, and related platforms.
• Translate emerging technology options into milestones, risks, decision points, and recommended next steps.
• Coordinate work across design, PDK, fabrication, process-integration, packaging, reliability, test, and external partner teams, including tapeout readiness and handoff to fabrication partners.
• Prepare concise design reviews, prototype summaries, and recommendations for senior technical, product, and business stakeholders.
• Support partner, supplier, university, and ecosystem discussions when technical representation is needed.

Benefits

• Equal opportunity/affirmative action employer status

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: Ph.D. or professional degree