Signal Integrity Engineer - MTS

Micron • Boise, ID

1d • Onsite

About The Position

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Signal Integrity team develops high-performance, innovative product signaling and power builds for HBM, GDDR, LPDRAM, DDR5/DDR6, PCIeGen7 or equivalent experience, and advanced signaling development. Our team leads interconnect and signaling research to support future performance growth using advanced signaling techniques and package/channel enhancements. This work includes circuit power reduction, data encoding, channel equalization, and new interconnect technologies. We participate in interface standardization efforts through JEDEC and similar organizations and maintain strong connections with customers and partners. Our focus also includes improving modeling and methods within the larger SI group and across Micron. Team members mentor emerging talent through informal one-on-one collaboration and formal department- and corporate-level knowledge sharing. We encourage collaboration across multiple areas and groups, including Signal Integrity, Circuit and Chip Design, Packaging R&D, System Integration, and Product Engineering.

Requirements

• Possession of a PhD or matching experience in addition to 5 years in the industry, or holding an MSEE with 10 years of industry experience
• Strong Signal and Power Integrity Background with a strong Mixed-signal Circuit Build Background, using AI
• Hands-on knowledge of 3D E.M. field solvers, Matlab, time and frequency domain simulation tools like HFSS, HSPICE, SPECTRE, ADS, etc.
• Solid understanding of lab measurement equipment such as Oscilloscopes, TDR, Vector Network Analyzer (VNA), etc.
• Ability to use AI/ML/LLMs for productivity and efficiency

Nice To Haves

• Pro-active – identify gaps and opportunities and address them with minimal direction.
• Ground-breaking – think “outside-the-box” and yet offer innovative solutions within a set of practical constraints.
• Communicator – clearly convey vital details of sophisticated issues and corresponding solutions in both written and verbal formats.

Responsibilities

• Develops high-performance, innovative product signaling and power builds for HBM, GDDR, LPDRAM, DDR5/DDR6, PCIeGen7 or equivalent experience, and advanced signaling development.
• Leads interconnect and signaling research to support future performance growth using advanced signaling techniques and package/channel enhancements.
• Focuses on circuit power reduction, data encoding, channel equalization, and new interconnect technologies.
• Participates in interface standardization efforts through JEDEC and similar organizations.
• Maintains strong connections with customers and partners.
• Improves modeling and methods within the larger SI group and across Micron.
• Mentors emerging talent through informal one-on-one collaboration and formal department- and corporate-level knowledge sharing.
• Encourages collaboration across multiple areas and groups, including Signal Integrity, Circuit and Chip Design, Packaging R&D, System Integration, and Product Engineering.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level