SI/PI Tech Project Manager

Broadcom • San Jose, CA

1d • Onsite

About The Position

Broadcom is seeking an experienced SI/PI Technical Project Manager to lead a team of engineers designing complex flip-chip-BGA packages, PCBs, system channel links for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 448G and higher, Optics, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. In this role, you will support and develop the engineering team, as well as contribute to technical methodologies and technical project management.

Requirements

• BSEE and 12+ years of experience in ASIC and system signal and power integrity for high-speed SerDes
• A minimum of 3 years in leadership/management
• Knowledge of package-level, PCB-level, and/or system level signal integrity and power integrity, to apply to package and PCB designs
• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
• Self-management, organization, and clear communication skills
• Technical understanding related to System Signal and Power Integrity development and support

Nice To Haves

• Previous experience managing people and projects

Responsibilities

• Navigate and track project plans for 20+ concurrent pkg/PCB designs (scope, schedules, resources) from a technical execution standpoint
• Understand the skill sets and traits of each team member, in order to maximize productivity and retention
• Organize team & customer activities to keep projects on track
• Clearly and concisely communicate plans, status, next steps and risks on a regular basis
• Create technical methodologies for signal and power integrity solutions
• Understanding and supporting package and PCB technologies with input from team members
• Customer, vendor, & cross-functional collaboration
• SI/PI EDA extractions and simulations
• System level SerDes channel results
• Lab measurements - passive and active
• Lab and measurement correlation efforts
• Lab equipment needs and management
• Package and PCB lifecycle and design flows
• How the substrate and package fit into the overall system implementation and trade-offs therein to support customers effectively
• Design Data, including how it is created and utilized (e.g. package:: .mcm, package spreadsheet, drawings (POD, Lid, Substrate))
• Automation code development
• Project Management

Benefits

• Discretionary annual bonus
• Competitive new hire equity grant
• Annual equity awards
• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• Company paid holidays
• Paid sick leave
• Vacation time
• Company follows all applicable laws for Paid Family Leave and other leaves of absence

What This Job Offers

• Job Type: Full-time
• Career Level: Senior