Senior Thin Films Metals Deposition Engineer

Intel Corporation•Hillsboro, OR

5d•$133,800 - $255,200•Hybrid

About The Position

Manufacturing Development Customer Engineering (MDCE) is a new organization within Intel Foundry Technology Manufacturing focused on improving process capability for Intel's technology nodes from initial product qualification to high volume manufacturing with the vision of making technology ramp a competitive advantage for Intel foundry. This team is responsible for transferring new technologies into high-volume manufacturing, driving process optimization and continuous improvement, resolving complex yield and manufacturing issues, partnering closely with technology development and factory teams to ensure robust, predictable silicon delivery. MDCE Metals Deposition Engineer is responsible for enabling best-in-class process performance and manufacturability for advanced metals deposition modules across Intel 18A, Intel 3, and Intel 12nm technology nodes. This role sits at the intersection of Technology Development (TD), High Volume Manufacturing (HVM), and Customer Engineering, driving module readiness from early development through full HVM ramp and sustaining.

Requirements

Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
6+ years of relevant experience in semiconductor manufacturing, process development, or technology development.
4+ years direct experience in metals deposition modules.
Hands-on experience with thin film deposition technologies in at least one of the following areas: Frontend or middle-of-line, Backend metals / interconnect or other critical conductive or barrier/liner films supporting logic technologies.
3+ years of experience with one or more deposition technologies: PVD, CVD, and/or ALD for metals, conductive films, or barrier/liner stacks.
Experience with integration and module interactions (e.g., Deposition with CMP, lithography, etch, clean) and impact of deposition on device performance and yield.

Nice To Haves

Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
Experience in advanced technology nodes (e.g., 10nm class and below), ideally with exposure to Intel 18A, Intel 3, Intel 4/7, or comparable leading-edge foundry nodes.
5+ years of direct experience in a metals deposition module such as Contact/MOL metals (e.g., W, Co, Ru, liners/barriers), BEOL / Cu interconnect (e.g., Cu/Co/Ru/W, caps, barriers, seed), advanced liners/barriers/adhesion layers or conductive films in logic nodes.
Experience with interconnect and MOL physics (RC performance, via/contact resistance, electromigration, reliability mechanisms) and their linkage to metals deposition and integration.
Proven experience driving process development, optimization, and transfer to HVM.
Experience supporting technology ramp or technology transfer from TD to HVM, including POR definition, process window characterization, and tool matching.
Hands-on ownership of metals deposition equipment (e.g., multi-chamber PVD/CVD/ALD platforms) including qualification, matching, and release to production.
Experience collaborating with equipment and materials suppliers on hardware changes, chamber design, or chemistry changes to improve yield, cost, or reliability.
Cross-functional leadership experience including experience leading or contributing to cross-site and cross-functional task forces for yield excursions, defect reduction, or technology ramp and demonstrated ability to work closely with factory teams, module and technical program stakeholders to implement metals deposition solutions in HVM.

Responsibilities

Align organizational goals with technical vision, formulate technical strategies to deliver cutting-edge solutions, and demonstrate relentless execution to meet customer needs on time.
Ability to gather diverse inputs, uplevel to the right strategic response.
Own the resolution of technical challenges and integrate solutions across multiple groups (including technology development and high volume manufacturing) Demonstrated ability to perform data driven root cause analysis using structured problem-solving methods and common data/analytics tools.
Work closely with direct and extended technology development (TD) and manufacturing (TFSM) members and Business Groups to achieve common goals.
Engage and interface with internal and external stakeholders, including Integration, Device, Yield, Defect Metrology, Quality and Reliability, and suppliers. Establish strong working relationships.
Stay updated on relevant industry direction setting technologies.
Conceptualize strategies and put them into motion swiftly to meet challenging schedules.
Define goals for the team, remove roadblocks, and facilitate timely delivery of process solutions. Own the outcome, surface and resolve issues quickly.
Work together with team members in person to enable faster decision making and problem resolution