Senior Staff Engineer, Electrical Design (Signal Integrity)

Celestica International LPSan Jose, CA
$128,000 - $200,000Onsite

About The Position

The Signal Integrity Engineer provides design guidelines and support across the entire product lifecycle including system architecture design, board layout, product bring-up, debugging, validation, and factory builds. In this role, you will perform testing, simulation, validation, and qualification of systems, making critical design adjustments as needed. You will work in a cross-functional team with other designers, customers, manufacturing engineering, and project leadership to ensure robust, high-quality product development. Additionally, you will enhance designs by incorporating feedback from reviews in areas such as manufacturing, testing, supply chain, reliability, industrial design, and simulations.

Requirements

  • Strong knowledge in simulation tools like Hspice, Sigrity, ADS, Ansys SIwave, HFSS 3D.
  • Strong knowledge in Signal Integrity and Power Integrity fundamental concepts.
  • Strong experience in Package and PCB modelling is required.
  • Keep up to date with relevant industry knowledge and regulations
  • 7–10 years of relevant experience in a similar role.
  • Bachelor's degree in Electrical Engineering or a related field.

Nice To Haves

  • May be a recognized expert (go to person) in one or more technical areas.

Responsibilities

  • Models high-density I/O's on PCBs, packages, connectors and probe cards with respect to parameters such as reflections, bandwidth, and crosstalk
  • Lead the design, development and implementation of technical solutions for complex projects, involving multiple domains. Participate in project planning and scheduling.
  • Performs Transmission line & Via modelling and carry out experiments to validate modelling outcomes and methodologies.
  • Should be able to analyze and review the layout files related to Signal integrity and Power Integrity problems.
  • Should be able to provide practical solutions to PCB/Package design team based on simulation results and analysis.
  • Conducting Simulation of memory interfaces for Board and Package and High Speed Serial IO interfaces for Board and Package.
  • Perform decoupling capacitor optimization, Loop inductance analysis.
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