Senior Semiconductor Process Engineer

Lockheed Martin•Goleta, CA

1d•Onsite

About The Position

The Senior FPA Process Engineer will be a subject matter expert for the fabrication and execution of advanced Focal Plane Arrays (FPAs), including wicking, substrate thinning, dicing, and flip-chip bonding for hybridization. This role is critical in developing and optimizing processes, procedures, tooling, and equipment to maximize yield, efficiency, and throughput. The engineer will precisely align and bond detector arrays and readout integrated circuits (ROICs) to create high-performance FPAs in a fast-paced, high-mix production environment. Assignments include defining processing and handling equipment requirements and specifications, and reviewing processing techniques and methods for FPA devices. The role involves adapting new processes into the manufacturing line, defining requirements for new capabilities, and managing capital procurement projects for FPA processing equipment. Responsibilities include analyzing test data, troubleshooting, failure analysis, and developing documentation to ensure adherence to quality standards.

Requirements

Bachelors degree from an accredited college in Material Science, Engineering, Physics, or related discipline.
3+ years of experience in semiconductor packaging or FPA manufacturing in a cleanroom environment with demonstrated expertise in either flip-chip hybridization techniques or related processes, such as epoxy die attach/bonding, polishing, substrate removal, or Anti-Reflection (AR) coating or semiconductor packaging techniques.
Must be a US Citizen, as this position is located at a facility that requires special access.

Nice To Haves

Master's Degree with 1+ year of industry experience, or PhD in Engineering, Physics, or related discipline.
Background in IR FPA packaging, specifically flip-chip hybridization techniques.
Knowledge of semiconductor device physics, photodetectors, and FPAs.
Proficiency in MS Office (Word, PowerPoint, Excel).
Excellent engineering documentation skills and communication skills.
Ability to interface effectively from the technician level to senior management with excellent communication (written and verbal) and interpersonal skills, with the ability to collaborate effectively with cross-functional teams and train technical staff.
Ability to multi-task, organize and prioritize assignments independently.
Experience in Design of Experiments (DOE), statistical process control (SPC), and data analysis software packages (e.g., JMP).
Experience with Lean/Six Sigma methodologies and data analysis software such as MATLAB or JMP.

Responsibilities

Work with development and process integration engineers to adapt new processes and techniques into the manufacturing line as required.
Define requirements for new capabilities and organize, lead, and execute FPA processing equipment capital procurement projects.
Responsible for projects related to process definition, fabrication, modification and evaluation of FPA devices and components.
Analyze test data, identify trends and anomalies, and provide feedback to drive process control and improvement initiatives.
Contribute to the troubleshooting and failure analysis of FPAs, identifying root causes and implementing corrective actions.
Develop and maintain documentation, including workflows, work instructions, and process control checklists, ensuring adherence to quality standards and industry protocols.