Senior Printed Circuit Board (PCB) Designer

Lockheed Martin•Severn, MD

1d•Onsite

About The Position

Space is a critical domain, connecting our technologies, our security and our humanity. While others view space as a destination, we see it as a realm of possibilities, where we can do more — we can innovate, invest, inspire and integrate our capabilities to transform the future. At Lockheed Martin Space, we aim to harness the full potential of space to cultivate innovation, reduce costs, and push the boundaries of what technology can achieve. We’re creating future-ready solutions, focusing on resiliency and urgency through our 21st Century Security® vision. We’re erasing boundaries and forming partnerships across industries and around the world. We’re advancing spacecraft and the workforce to fuel the next generation. And we’re reimagining how space can connect us, ensuring security and prosperity. Join us in shaping a new era in space and find a career that's built for you. We are seeking an expert RF PCB Designer to lead the development of high speed, high frequency printed wire assemblies (PWAs) covering HF-Ka Bands (10MHz-40GHz). The successful candidate will own complete board level RF design cycles—from concept, schematic capture, through layout, fabrication while ensuring compliance with all applicable IPC standards and leveraging state of the art fabrication materials. In addition, this senior designer will mentor mid-level and junior RF PCB engineers, drive best in class design for manufacturability (DFM) practices, and support the program’s security controlled environment.

Requirements

Associates or Bachelor’s degree in Electrical/Electronic Engineering, or a closely related field.
Hands on RF PCB design experience in HF-Ka Bands (10MHz-40GHz).
Demonstrated experience designing Printed Wire Assemblies (PWA) for high frequency/high power systems.
Proficiency with high frequency PCB layout tools (Altium Designer, Siemens Xpedition).
Solid understanding of transmission line theory, controlled impedance routing, via design, filter integration, and high speed signal integrity.
In depth familiarity with all IPC references listed above, including the ability to interpret and apply them to classified projects.
Materials Expertise: Practical knowledge of advanced PCB substrates and finishes (Rogers, Taconic, Isola, Nelco, Duroid, PTFE, ceramic, flexible rigid laminates) and the impact of material properties on loss, dielectric constant, thermal expansion, and reliability.
Excellent written and verbal communication, strong problem solving mindset, and ability to work cross functionally with RF, mechanical, firmware, and test teams.
Ability to obtain & maintain an active TS/SCI clearance

Nice To Haves

15+ years of hands on RF PCB design experience in HF-Ka Bands (10MHz-40GHz).
Certifications: IPC Designer Certification (CID), Certified RF Engineer (e.g., IEEE RF), or equivalent.
Tool Proficiency: Schematic capture as well as PCB layout experience with Siemens Xpedition, Zuken CR8000, Altium Designer, as well as SolidWorks PDM version control for PCB data CM systems.
Exposure to 3D printed RF structures, low temperature co fired ceramic (LTCC), embedded passive components, or integrated antenna in package designs.
Expertise in EM simulation (HFSS, CST, ADS Momentum, SIwave).
Security & Compliance: Proven ability to work in a Top Secret environment, handling classified data per DoD/National Security regulations.

Responsibilities

Own complete board level RF design cycles—from concept, schematic capture, through layout, fabrication while ensuring compliance with all applicable IPC standards and leveraging state of the art fabrication materials.
Mentor mid-level and junior RF PCB engineers.
Drive best in class design for manufacturability (DFM) practices.
Support the program’s security controlled environment.