Senior Printed Circuit Board (PCB)/Layout Design Engineer- Auburn Hills

Nexteer Automotive Corporation•Pontiac, MI

20d•Hybrid

About The Position

At Nexteer, our strength lies in the diversity of our team—each member contributing unique backgrounds, experiences, and aspirations. We believe this diversity fuels our innovation, broadens our perspectives, and propels our collective growth. For over a century, we’ve been innovators in the automotive industry. Our vision is clear - we are a global leading motion control technology company accelerating mobility to be safe, green and exciting. Our unwavering commitment to Quality, Collaboration, Integrity, and Accountability guides us as we solve motion control challenges for our global customers. If you’re ready to join a dynamic team that drives change and makes a difference, Nexteer welcomes you! The Powerpack Architecture team develops advanced printed circuit board technologies for high‑performance Electric Power Steering (EPS) systems. The team applies rigorous engineering practices—spanning schematic design, multilayer PCB layout, manufacturability optimization, simulation, and emerging AI‑driven automation—to deliver robust, production‑ready electronic hardware. This senior role leads the design and release of complex PCB assemblies for EPS controllers, including schematic ownership, IPC/Nexteer design standards‑compliant layout, DFM/DFA/DFT integration, and the development of new AI‑based tools and workflows that improve design quality, speed, and manufacturability. This role would have the ability to work a hybrid schedule and when in office can work in either Saginaw or Auburn Hills.

Requirements

12+ years of PCB design experience, preferably in automotive electronics or EPS‑related hardware.
Extensive experience designing complex PCBs for High Current Low Voltage automotive or high‑reliability embedded systems.
Deep knowledge of IPC rules for FR4 and flexible circuits, HDI technologies, multilayer stack‑ups, routing constraints, and thermal management of High-Power dissipation electrical components.
Proficiency with EDA Tool Mentor Expedition.
Proficiency with Mentor EDM project management.
Strong expertise in DFM/DFA/DFT methodologies and PCB/EMS manufacturing processes.
Strong understanding of electrical circuit design, electromagnetic principles, and SI/PI/thermal simulation.
Extensive experience with Electronics Manufacturing Services pertaining to CCA integration with EPS powerpack mechanical integration.
Excellent communication, documentation, and cross‑functional leadership skills; proven ability to lead complex engineering projects and mentor junior designers.
Extensive knowledge of ECAD/MCAD exchange pertaining to CCA to MCAD integration.

Responsibilities

Lead IPC‑compliant, production‑intent multilayer PCB layouts for EPS controllers, including stack‑up definition, routing strategies, and controlled‑impedance designs.
Own schematic capture and design updates, ensuring accuracy, traceability, and alignment with system‑level requirements.
Perform and guide advanced DFM/DFA/DFT reviews using Mentor Graphics Valor or EasyLogix PCB Investigator.
Perform and guide advanced Mentor Hyperlinx SI/PI simulation for PCB resistance and current density that aligns with system-level requirements.
Perform and guide advanced Mentor Hyperlinx DRC simulations for alignment with EMC/EMI/Nexteer best practices for layout design.
Create PCB fabrication drawings, stack‑up documentation, and complete design release packages using standardized templates.
Lead root‑cause analysis and resolution of complex PCB issues involving thermal behavior, electromagnetic effects, manufacturability, and assembly defects.
Oversee component library management, including symbol/footprint creation and validation.
Direct BOM development and ensure alignment with electrical, mechanical, and manufacturing constraints.
Drive Global continuous improvement initiatives, including workflow automation, design standardization, and development of new AI‑enabled PCB design and verification tools.
Collaborate with global cross‑functional teams and EMS partners to optimize PCB fabrication and assembly processes for cost, quality, and robustness.