Senior Principal Mixed Signal Design Engineer (Hybrid)

RTX•Goleta, CA

1d•$145,600 - $276,800•Hybrid

About The Position

Raytheon Vision Systems is seeking a talented Senior Principal Mixed Signal Design Engineer to join our design team. This position will be hybrid based in Goleta, CA or Phoenix, AZ. As part of this team, you will collaborate in a fast-paced multidisciplinary team environment to develop cutting-edge image sensor products. You will participate in mixed-signal ASIC/ROIC development activities with cross-functional teams including chip architecture, specification, design, verification, validation, fabrication, packaging, debugging, test development, failure analysis, and documentation.

Requirements

Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 10 years of prior relevant experience or an advanced degree in a related field and a minimum of 7 years of prior relevant experience.
Experience leading program development for commercial, defense, and/or space industries to complete designs on schedule and within allocated budget.
Experience with semiconductor device physics, semiconductor processing, linear IC design, simulation, layout (i.e. hand layout critical analog & mixed-signal circuits), and testing.
Experience in full-custom CMOS Integrated Circuit (IC) design at the transistor level.
Experience with IC Design Flows and any of the following tools: CAD tools such as Cadence and Mentor Graphics (Siemens).
Analysis & programming tools such as MATLAB.
Computer programming or scripting language such as Python.
High-end UNIX based software design tools for circuit simulation, transistor model extraction, noise analysis, linear design, layout and layout automation, and verification.
Modelling experience with System Verilog/Real Modelling/Verilog AMS and coding synthesizable RTL

Nice To Haves

Advanced digital design skills such as experience with Conformal, experience with Digital-on-top mixed-signal design flow including utilization of Innovus for final chip construction, and experience writing behavioral models for digital circuits and analog/mixed signal interfaces and circuits.
Experience with certain IP and circuit blocks such as LVDS transmitters and receivers, low noise and low power amplifiers, ADC design, PLL/Transmitter design and radiation and cryogenic tolerant design techniques.
Knowledge of high-end UNIX based software design tools for circuit simulation, transistor model extraction, noise analysis, linear design, layout and layout automation, and verification is preferred.
Familiarity with ROIC architecture, design concepts, operational control and timing.

Responsibilities

Design, develop, and characterization of Readout Integrated Circuits (ROICs) for advanced sensing systems.
Evaluate various aspects of the process flow from design to synthesis, place and route, timing and power use. Candidate also must be able to determine architecture design, logic design, and system simulation and define module interfaces for simulation.
Design mixed-signal integrated circuits for image sensors, including analog signal chain, digital timing and image processing, and low-power 12 – 14 bit on-chip analog to digital converters.
Guide and coordinate teams of highly skilled engineers in complex, multidisciplinary technical environments.
Communicate complex technical concepts and program status through briefings and technical reviews with senior government and customer stakeholders, including flag officer–level leadership.