Senior Principal Mechanical Engineer (Onsite)

RTX•Goleta, CA

6d•$145,600 - $276,800•Onsite

About The Position

As a Senior Principal Mechanical Engineer in the Electronic Warfare Mechanical Design Hardware Department, you will lead the design and development of airborne RF and digital processor subsystems from early concept through production deployment. This role requires deep expertise in electronics packaging, thermal and structural analysis, manufacturing processes, and high reliability hardware development.

Requirements

Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 10 years of prior relevant experience or an advanced degree in a related field and minimum 7 years experience.
Experience in electronics packaging for high reliability environments and in supporting hardware through environmental qualifications (vibration, shock, thermal).
Working knowledge of electronics/processor systems design and development utilizing COTS/MOTS components and products.
Experience with GD&T and ASME drawing standards appropriate for production level hardware.
Experience with 3D solid modeling tools such as Creo/ProEngineer or similar for mechanical design and documentation.
U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.
The ability to obtain and maintain a U.S. government issued security clearance is required.
Active and existing security clearance required after day 1.

Nice To Haves

Experience in leadership in mechanical design and development of defense-related electronic systems, including subsystem lead/REA/IPTL or similar technical authority experience.
Experience across the full engineering lifecycle: bidding, design, implementation, delivery.
Experience in earned value management (EVMS) and associated engineering tracking and metrics.
Background in Electronic Warfare, radar, RF subsystems, or airborne electronics.
Thermal and structural analysis experience using FEA tools.
Knowledge of CCA/PCB integration, cabling/harness design, and RF isolation.
Experience conducting PDR/CDR/TRR reviews and presenting technical data to customers.
Proposal development experience, including BOEs and technical volumes.
Experience in root cause analysis and corrective actions within production environments.
Knowledge of parts management and materials/process engineering.
Success working in fast-paced, dynamic product development environments.

Responsibilities

Lead mechanical design and development of airborne RF and digital electronics subsystems from concept to production.
Serve as the mechanical technical authority (REA/IPTL) to ensure alignment with technical, cost, and schedule objectives.
Communicate technical status and risks to executive leadership; present at internal and customer design reviews.
Develop requirements, design documentation, trade studies, verification plans, test artifacts, and technical presentations.
Own subsystem level mechanical solutions capable of meeting demanding thermal, structural, and vibration requirements.
Collaborate with cross functional teams in Electrical, Systems, Manufacturing, and Supply Chain to deliver integrated hardware.
Mentor junior engineers and provide technical guidance across the matrixed team.
Support hardware integration, verification, and production readiness activities within secure program environments.
Contribute to proposal efforts, including cost estimates and technical volume content.
Occasional travel (10–20%) to Raytheon facilities, suppliers, or customer sites is expected.