For nearly a decade, Intel's Neuromorphic Computing Lab has explored architectures, algorithms, and software inspired by the brain's efficiency, scalability, and adaptability. Our Loihi series of research chips pioneered event-driven, sparse, and massively parallel neuro-inspired processing. Now, we're entering an exciting new chapter: transforming these breakthroughs into real-world products that will power the coming era of physical AI systems. This role is for a senior physical design engineer passionate about driving innovation at the intersection of advanced semiconductor technologies, physical AI, and next-generation computing architectures. As a member of Intel's neuromorphic silicon team, you will engineer physical integration solutions spanning chiplet and advanced packaging technologies. You will help overcome the performance, area, and power limitations of today's AI architectures and lead block- and chip-level closure activities, driving designs to achieve their performance, power, and area targets. An openness to learning new technologies and methodologies, such as asynchronous design techniques and AI-driven automation and debug, is essential.
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Job Type
Full-time
Career Level
Senior