Senior Packaging Engineer
Qualcomm•San Diego, CA
•$127,200 - $190,800•Onsite
About The Position
The IC Package Engineering (PKGE) team is responsible for developing and deploying advanced packaging technologies to meet increasingly demanding performance, reliability, and system integration requirements. This position is responsible for Package Mechanical Characterization, reliability evaluation of advanced IC packages, and system-level interactions. The ideal candidate is a highly motivated self-starter with strong technical depth, hands-on execution capability, and the ability to translate experimental data into actionable insights to drive product reliability and development decisions.
Requirements
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
- Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
- PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
Nice To Haves
- Experience with semiconductor packaging, SMT/BLR processes, or mechanical characterization.
- Experience with mechanical stress/strain characterization
- Hands‑on experience with reliability and mechanical test equipment, such as: Thermal Cycling Chambers (TC), Drop shock test system, Instron or Universal Testing Machines (UTM), High‑speed Data Acquisition (DAQ) Systems
- Experience with metrology tool, such as: Shadow Moiré, DIC, TMA, DMA, C-SAM, X-ray
- Knowledge of industry standards (JEDEC, IPC, ASTM, AEC)
Responsibilities
- Define and execute Design of Experiments (DOE) for package, board-level, and system-level reliability evaluation.
- Perform PCB assembly, rework, and troubleshooting for test vehicles and products
- Analyze experimental results using statistical methods and reliability modeling (e.g., Weibull analysis)
- Develop and implement new test methodologies to evaluate emerging packaging technologies
- Collaborate with Design, NPI, FA, Thermal, and other teams
- Provide guidance to technicians and support lab operations
- Generate technical reports, documentation, and presentations for internal and customer-facing use
- Provide data-driven recommendations to support design and product decisions
- Interface with vendors and suppliers for new materials, equipment, and process improvements
Benefits
- competitive annual discretionary bonus program
- opportunity for annual RSU grants
- highly competitive benefits package
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What This Job Offers
Job Type
Full-time
Career Level
Senior
