Senior Packaging Development Engineer
About The Position
Are you passionate about pushing the boundaries of optical package design? We're seeking a talented and driven Packaging Development Engineer to lead the development of next-generation packaging solutions. In this role, you'll be at the forefront of innovation, collaborating with cross-functional teams to optimize electrical assembly and RF signal efficiency and ensure seamless transition to mass production. If you're eager to own the design and development of flip chip, fan out, semiconductor dicing, and reflow processes, while staying abreast of cutting-edge technologies, we encourage you to apply!
Requirements
- Experience in optical package design.
- Experience in flip chip, fan out, semiconductor dicing, and reflow processes.
Responsibilities
- Lead the development of next-generation packaging solutions.
- Collaborate with cross-functional teams to optimize electrical assembly and RF signal efficiency.
- Ensure seamless transition to mass production.
- Own the design and development of flip chip, fan out, semiconductor dicing, and reflow processes.
- Stay abreast of cutting-edge technologies.
Benefits
- Corporate Retirement Savings Plan
- Health and dental benefits
- Short-term disability, and long-term disability
- Life insurance, and AD&D – Company paid 2x base pay
- Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
- Paid time off for holidays and Vacation
- Employee Stock Purchase Plan
- Tuition Assistance Plan
- Adoption assistance
- Employee Assistance Program/Work Life Resource Program
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
What This Job Offers
Job Type
Full-time
Career Level
Senior
Education Level
No Education Listed
