Senior Manager, HBM Customer Integration Technical Leader

Micron Technology • Boise, ID

38d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of the Customer Engineering Technical Leadership (CETL) function within HIG PSE, the Technical Leader will serve as a key technical interface between external customers and internal engineering teams. In conjunction with CIL (Customer Integration Lead), this role requires deep technical engagement to understand customer application requirements and align them with internal HBM design, product engineering, and manufacturing processes (Front-End and Back-End). The position emphasizes technical problem-solving, multi-functional teamwork, and driving integration success for advanced HBM products. Develops and deploys AI systems that help automate processes and tackle technical challenges.

Requirements

• Minimum Qualifications:
• In conjunction with CIL, participate in technical discussions with customers, including design reviews and debug sessions.
• Communicate technical solutions clearly and optimally to both customer engineering teams and internal collaborators.
• Lead root-cause analysis for integration issues and propose design or process optimizations.
• Ensure timely resolution of technical partner concerns and maintain alignment across engineering and manufacturing teams.
• Lead the strategy, development, deployment, and adoption of engineering capabilities powered by intelligent technology that accelerate product development across system validation, debug, characterization, and customer enablement workflows.

Nice To Haves

• Preferred Qualifications:
• Bachelor’s or Master’s degree or equivalent experience in Electrical Engineering, Computer Engineering, or related technical field.
• 10+ years in semiconductor product engineering, system integration, or customer-facing technical roles.
• Hands-on experience with HBM architecture, packaging, and manufacturing processes highly desired.
• Ability to interpret customer system-level requirements and map them to internal design and process capabilities.
• Excellent communication and collaboration skills across technical and non-technical teams.

Responsibilities

• Develop a strong understanding of customer system architecture, application requirements, and integration challenges.
• Translate customer technical needs into actionable requirements for internal design, product engineering, and manufacturing teams.
• Provide technical mentorship on HBM architecture, signal integrity, thermal solutions, and packaging strategies.
• Develops and deploys AI (artificial intelligence) systems that help automate processes and tackle technical challenges
• Work closely with internal teams across front-end/back-end process engineering, product development, and manufacturing to ensure seamless integration.
• Support design reviews, failure analysis, and yield improvement initiatives tied to customer requirements.
• In conjunction with CIL, participate in technical discussions with customers, including design reviews and debug sessions.
• Communicate technical solutions clearly and optimally to both customer engineering teams and internal collaborators.
• Lead root-cause analysis for integration issues and propose design or process optimizations.
• Ensure timely resolution of technical partner concerns and maintain alignment across engineering and manufacturing teams.
• Lead the strategy, development, deployment, and adoption of engineering capabilities powered by intelligent technology that accelerate product development across system validation, debug, characterization, and customer enablement workflows.

Benefits

• choice of medical, dental and vision plans
• benefit programs that help protect your income if you are unable to work due to illness or injury
• paid family leave
• robust paid time-off program
• paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: Associate degree