Senior Lead Electrical Engineer, Manufacturing Process

Celestica • Tucson, AZ

1d • Onsite

About The Position

The Senior Lead Engineer, Manufacturing Process is responsible for designing, developing, deploying and optimizing processes for manufacturing to achieve quality cost and delivery goals for Celestica and its customers products. This role involves understanding and implementing the customer’s technical roadmap and related process development projects. The engineer will lead and implement the development and release of the full manufacturing process for new customer products, and provide feedback on customer’s technical requirements. A key responsibility is developing and implementing costed and optimized feedback using Design for manufacturability (DFX) tools and processes to reduce manufacturing cost and improve product quality and reliability. The role also includes developing, planning, and leading the assessment of process application capability using Design of Experiments, devising process controls and data collection strategies, and evaluating complex data to report yield, reliability, and root cause failures impacting product quality. Ensuring accurate and timely communication to management on critical technical and business issues is also essential.

Requirements

• Project Management - Ability to manage/lead complex, multiple line engineering projects that may also involve other functions. Demonstrate solid understanding of the technical, financial and people aspects of the project. Able to create a project/change management plan and ensure that the project is delivered within the assigned time and budget. Ability to recognize project barriers and develop mitigation plans.
• Leadership - Demonstrate "People & Team Leadership Behaviors" as per Celestica Leadership Imperatives.
• Financial Acumen / Business Planning - Ability to create financial plans for your projects, align them internally with your line of management and other functions and externally if needed. Create project plans, profitability calculations, risk and sensitivity analysis, able to recognize barriers and mitigate profitability risks. Fully knowledgeable about internal and external financial reporting, accounting and tax requirements relevant to your area of expertise.
• NPI-PCBA : ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, MT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / Phanuel / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Engineering Control & System Tools (ODC/SCE), Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes, structural test and inspection processes, machining, welding, CNC programming, secondary processes, sheet metal, DFAA.
• DFX : ESD Controls, Component Prep, Component Module Programming, Laser Marking, Screening, Stencil Design, Solder Paste Dispense / Jetting, SMT Programming, SMT Placement, SMT Reflow, Sweat Soldering, Flex Board Assembly / Handling, Pallet Design, PTH Soldering, Robot Soldering, PTH manual Assembly, PTH Auto Assembly, Pressfit, Depanelization, Mechanical Assembly (TIMs, Heatsinks, PCBA, Hotbar, Ultrasonic Welding), Wire Harness Assembly, Wire Prep, System Assembly, SMT and PTH Rework, Cleaning Processes, Conformal Coating, Underfills /Edge bonding / Potting, Pack and Ship, Chassis Assembly (fluidics, electrical enclosure, cable routing), Sheet Metal ,Machining, Welding, Structural Test (API, AOI, AXI, ICT, Flying Probe).
• FA LAB : ESD Controls, Solder Metallurgy, Strain Gauge Analysis, SIR Testing, Solder Joint Reliability Modeling, Sample Prep (Grind and Polish), Dye & Pry, CMM/VMM, Lab X-Ray, Pull/Bend Testing, Vibration Testing, Drop Testing, TDR, XRF, SEM, FTIR, IC, Solderability Testing, Thermal Analysis, HALT/HASS, TH&B, Thermal Shock, ATC
• OPTICAL & XRAY INSPECTION: ESD Controls, Auto Wire Prep, SMT Data Analytics, API, AOI (PCBA), AXI(PCBA), AOI (System), Test Strategy Creation, IPC-610, Quality Dat (KPI), DFM - Manufacturing, DFA - Assembly, DFT / Physical Test, DFT - Electrical Test
• MACHINING & OTHER: ESD Controls, Pack & Ship, CNC programming, Secondary Processing, Sheet Metal, Machining, Welding, DFM - Manufacturing
• MECHANICAL & SYSTEMS ASSEMBLY: ESD Controls, Wire Harness Assembly, Auto Wire Prep, Mechanical Assembly - System Build, OEE / Industrial Engineering, Pack & Ship, Vacuum System, Fluidics, Electrical Enclosure, Cable Routing, Electrical - Automation, Mechanical - Automation, Machine Vision, IPC-610, Engineering Controls, Quality Data (KPI), Manufacturing Operational Management, DFM - Manufacturing, DFA - Assembly, DFAA - Automated Assembly, DFT - Physical Test
• PCBA ASSEMBLY : ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI),Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes.
• MICROELECTRONICS: ESD Controls, Wafer Thinning, Wafer Singulation, Edge Polishing, Optical Coatings, Die Bonding, Vacuum Reflow, Flip Chip Bonding, Underfill, Active Alignment, Plasma Cleaning, Wire Bonding, Encapsulation, Sealing, Leak Testing, Interconnect Formation
• Four to six years of experience in a similar role or industry.

Nice To Haves

• Coaching/Mentoring
• Communication/Negotiation/Presentation
• Creative Problem Solving
• Customer Interaction/Stakeholder Management
• Quality & Lean
• Working Effectively with Others
• D/PFMEA
• 8D/Corrective Action
• Equipment Safety
• Design of Experiments (DOE)

Responsibilities

• Responsible for understanding and implementing the customer’s technical roadmap and related process development projects.
• Lead and implement the development and release of the full manufacturing process for new customer products.
• Understand and provide feedback on customer’s technical requirements to team members and management.
• Responsible for developing and implementing costed and optimized feedback using Design for manufacturability(DFX) tools and processes, with the goal of reducing manufacturing cost and improving quality and reliability of product.
• Develop, plan and lead the assessment of the capability of process applications using Design of Experiments.
• Devise process controls and data collection strategies and evaluate complex data to assist with reporting yield, reliability and diagnoses to root causes failures impacting product quality.
• Ensure accurate and timely communication to management on critical technical and business issues.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior