Senior Heterogenous Integration Process Engineer

Tokyo Electron•Albany, OR

16d•$123,806 - $174,946•Onsite

About The Position

TEL Technology Center, America (TTCA) is TEL's advanced R&D center in the United States, driving innovation in next-generation semiconductor process technologies and equipment solutions. Leveraging expertise in semiconductor processing, materials science, device integration, and equipment engineering, TTCA collaborates with customers, research institutions, and TEL's global R&D network to solve critical technology challenges. From concept development to manufacturing enablement, our team develops innovative solutions that support future semiconductor technology roadmaps and advance semiconductor manufacturing worldwide. The 3DI Technology Group at TEL Technology Center, America (TTCA) develops next-generation heterogeneous integration and 3D device integration technologies for future semiconductor applications. Our focus includes fusion bonding, hybrid bonding, wafer-to-wafer (W2W) and chip-to-wafer (C2W) integration, wafer thinning, and TSV technologies, enabling advanced architecture such as bonded-CFET, VCT DRAM, and 3D-stacked memory and logic devices. As a 3DI R&D Engineer, you will lead the development of innovative process and equipment solutions through fundamental research, process development, and technology pathfinding. Working closely with leading customers, research partners, and TEL's global R&D teams, you will help define and enable the next generation of semiconductor integration technologies.

Requirements

Ph.D. in Materials Science, Mechanical, Chemical, Electrical Engineering, Physics, Chemistry, Nanotechnology, or a related field.
5+ years of semiconductor R&D experience.
Strong expertise in advanced packaging, heterogeneous integration, and/or 3D device integration.
Hands-on experience in wafer bonding, process integration, or related semiconductor technologies.
Proven problem-solving, analytical, and experimental skills.
Strong project management and organizational capabilities.
Understanding of semiconductor technology roadmaps and industry trends.
Excellent verbal and written communication skills.
Strong record of technical innovation through publications, patents, or industry contributions.
Demonstrated leadership in cross-functional technical programs.
Ability to work effectively in a multicultural and global environment.

Responsibilities

Lead R&D programs in advanced 3DI technologies, including C2W, D2W, and wafer bonding.
Define technical strategy and align R&D activities with business objectives.
Collaborate with global teams, customers, and joint development partners.
Conduct fundamental research and develop innovative processes and hardware solutions.
Evaluate technology feasibility through modeling, simulation, and experimentation.
Drive technology pathfinding for heterogeneous and 3D device integration.
Mentor researchers and foster technical excellence across the organization.
Provide technical leadership for customer engagements and internal development programs.
Communicate technical results and recommendations to key stakeholders.