Senior Hardware Engineer: Connectivity Modules

General Motors•Sunnyvale, CA

1d•$135,000 - $209,000•Hybrid

About The Position

Connectivity is a critical enabler of advanced vehicle functionality, including safety, user experience, and cloud-connected services. We are seeking a Senior Hardware Engineer to lead the design and system integration of next-generation automotive connectivity platforms across GM vehicle architectures. The ideal candidate has strong experience in hardware architecture, system bring-up, and cross-functional integration of complex embedded systems combining high-performance compute and wireless connectivity. They are comfortable operating across hardware, firmware, and RF domains to drive system-level decisions and resolve complex issues.

Requirements

Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science or related field.
5+ years of experience in hardware development, including board design, system bring-up, and debugging.
Strong experience designing and integrating complex embedded hardware systems.
Experience with SoC-based systems, including power architecture, clocks, resets, and boot flows.
Experience with high-speed digital design (PCIe, USB, Ethernet, LPDDR) including signal and power integrity considerations.
Proven ability to debug system-level issues across hardware, firmware, and RF domains.
Experience with power delivery design, PMICs, Voltage regulators, low-power design principles, and deep sleep/wake-up flows.
Strong problem-solving skills with ability to navigate complex, ambiguous system issues.
Ability to independently drive technical decisions and influence cross-functional teams.

Nice To Haves

Master’s degree in related engineering field.
8+ years of experience in hardware development, including board design, system bring-up, and debugging.
Knowledge and experience in wireless interfaces and technology.
Experience with automotive hardware development (EMI/EMC, environmental, reliability).
Experience supporting products through production ramp and field issue resolution.

Responsibilities

Own end-to-end hardware design and bring-up of connectivity modules from concept through production.
Define system architecture, including SoC selection, memory (LPDDR), power architecture, and high-speed interfaces (PCIe, USB, Ethernet).
Drive schematic design reviews and guide PCB layout, ensuring strong SI/PI, RF coexistence, and manufacturability.
Lead board bring-up, including power sequencing, clocking, reset, and boot initialization.
Drive system-level integration across hardware, firmware, RF, and mechanical domains.
Perform root-cause analysis of complex, cross-domain issues, including interactions between silicon, board design, RF, and software.
Make system-level tradeoffs across performance, power, cost, thermals, and reliability.
Validate high-speed interfaces including LPDDR5, PCIe, USB, Ethernet, SPI/I2C, CAN, and LIN.
Debug multi-domain issues such as RF desense, power noise coupling, and signal integrity degradation.
Collaborate with silicon vendors (e.g., Qualcomm, NXP, TI) on SoC bring-up and interface behavior.
Collaborate with firmware and software teams to enable platform functionality and debug system issues.
Define validation strategy and coverage, ensuring system-level robustness across corner cases and operating conditions.
Leverage lab instrumentation (oscilloscopes, VNAs, spectrum analyzers, logic analyzers) to characterize and debug system performance.