Senior Hardware Engineer – Digital, Power and FPGA

Radwin•Chennai, TN

3d•Onsite

About The Position

RADWIN is looking for a hands-on Senior Hardware Engineer to develop next-generation wireless platforms based on Qualcomm networking SoCs, ARM-based processors, and FPGAs. Reporting to the Platform Group Manager, you will take technical ownership of digital and power hardware development, from architecture and schematic design through board bring-up, validation, and production. You will work closely with RF and antenna, mechanical, software, firmware, compliance, and manufacturing teams.

Requirements

BSc in Electrical Engineering.
At least 10 years of hands-on digital hardware design experience.
Proven ability to independently own complex hardware designs from architecture through production.
Experience designing boards based on Qualcomm SoCs, such as IPQ networking platforms, or comparable high-performance processors.
Strong high-speed digital design experience, including DDR3/4/LPDDR, PCIe, USB 3.x, multi-gigabit Ethernet, and SerDes.
In-depth experience with DC/DC converters, PMICs, power sequencing, and PoE.
Hands-on FPGA board design experience using AMD/Xilinx, Intel/Altera, or Lattice devices.
Proficiency in OrCAD Capture and experience guiding and reviewing PCB layouts in Allegro or equivalent tools.
Experience with SI/PI simulation tools such as HyperLynx, SIwave, or Sigrity.
Strong board bring-up and lab debugging skills on complex multilayer boards.
Experience with EMC, surge, and safety standards, such as EN 55032, IEC 61000-4-x, and IEC 62368-1.
Strong communication skills and the ability to collaborate across engineering disciplines.
Excellent written and spoken English.

Nice To Haves

MSc in Electrical Engineering.
Experience with telecom, wireless, or outdoor networking equipment.
Experience with Wi-Fi 6/7 access points or base stations.
HDL knowledge, including VHDL/Verilog, and experience with FPGA timing closure.
Experience with timing and synchronization technologies, including SyncE, IEEE 1588, and GNSS.
Familiarity with railway or industrial standards, including EN 50155 and EN 50121.
Python scripting for test automation.
Experience working with contract manufacturers in Asia.
Experience mentoring engineers or providing technical leadership.

Responsibilities

Develop hardware architectures, block diagrams, and detailed designs, taking projects from concept through mass production.
Design processor-based boards using Qualcomm SoCs and other ARM-based processors, including DDR memory, flash, PCIe, USB, Ethernet/SerDes interfaces, clocking, and reset circuits.
Design power systems, including multi-rail PMICs, DC/DC converters, power sequencing, PoE (PD/PSE), protection circuits, and power budgets for outdoor products operating across wide temperature ranges.
Develop FPGA board designs, including device selection, pin planning, configuration, high-speed interfaces, and integration with FPGA and firmware engineers.
Create and maintain schematics in OrCAD Capture.
Guide PCB layout, define stack-up and signal- and power-integrity constraints, and review component placement and routing.
Perform signal-integrity, power-integrity, and thermal analyses, validating results against lab measurements.
Bring up and debug complex boards with software and firmware teams using oscilloscopes, logic and protocol analyzers, JTAG, and power analyzers.
Define and execute hardware design verification tests, including margin, temperature, power, and reliability testing.
Support EMC, surge, and safety qualification.
Work with Qualcomm and other component vendors on reference designs, design reviews, and technical issue resolution.
Support manufacturing test development, production troubleshooting, component obsolescence, and design improvements.
Contribute to design reviews, engineering documentation, and design guidelines, and share technical expertise with other engineers.