Senior Engineer

Rockwell Automation•Mequon, WI

9d•Hybrid

About The Position

This position will support global electronic assembly operations with significant onsite time at Mequon and New Berlin facilities, and reports to the manager of manufacturing process engineering - PCBA. This engineering role supports global electronic assembly operations across Rockwell Automation facilities and operates within a specialized team positioned at the intersection of manufacturing excellence, technology roadmap ownership, process standardization, and advanced process analysis. The mission is to provide expert-level leadership in electronic assembly to enhance quality, reliability, throughput, and long-term profitability through standardization, strategic capital deployment, and technology innovation.

Requirements

Bachelor's Degree in Relevant Field
Legal authorization to work in the U.S.
We will not sponsor individuals for employment visas, now or in the future, for this job opening

Nice To Haves

Typically requires a minimum of 5 years of related experience
BS or MS in Engineering (Mechanical, Electrical, or Industrial preferred)
2–5+ years hands‑on electronic assembly manufacturing experience
Depth in solder profiling, SMT, post‑SMT or conformal coat processes
IPC‑A‑610 familiarity
Lean Six Sigma experience (Green Belt+ preferred)

Responsibilities

Maintain deep expertise in at least two electronic assembly processes, including but not limited to: Wave soldering, Selective soldering, Conformal coating, PCB panel singulation, SMT solder printing, SMT pick-and-place, SMT reflow, AOI, equipment maintenance & troubleshooting
Develop and deploy global electronic assembly process standards
Reduce cost, improve quality, and increase throughput
Author and maintain procedures, work instructions, and training materials
Drive compliance to best‑practice standardization across global facilities
Lead equipment selection, justification, purchase, and implementation
Manage capital projects from requirement definition through production release
Benchmark emerging electronic assembly technologies via suppliers, industry conferences, and technical forums
Assessing global electronic assembly manufacturing facilities against standardized criteria
Use DOE, control charts, and statistical analysis
Monitor and report electronic assembly KPIs to drive continuous improvement
Apply Lean Six Sigma methodologies (DMAIC and DMADV)
Partner with design teams on DFM / DFA
Integrate assembly considerations into Electronic Assembly Design Guidelines
Share knowledge through presentations, documentation, and technical reviews