About The Position

The RAM Detection organization within Micron Technology focuses on enabling inline visibility and control through industry‑leading RDA and Metrology solutions. The team partners closely with global NAND and DRAM manufacturing sites, Technology Development (TD), High Volume Manufacturing (HVM), and key suppliers to improve yield, quality, cost, and cycle time through advanced detection strategies and standardization. As a RAM Detection (RDA & Metrology) Detection Strategy Senior Engineer / Principal Engineer, you will lead global detection strategy and execution across Micron’s network. This role drives Best Known Method (BKM) development and deployment, detection capability advancement, supplier engagement, and cross‑site alignment to enable yield improvement and manufacturing excellence at scale.

Requirements

  • Bachelor’s degree in Engineering or equivalent technical discipline.
  • 3+ years of industry experience in RDA and/or Metrology within semiconductor manufacturing.
  • Demonstrated experience managing technical projects or programs, including timelines, risks, and deliverables.
  • Proven ability to collaborate effectively across multi-functional and cross‑site teams.
  • Willingness and ability to support international travel, including extended international business assignments (up to 6 months).

Nice To Haves

  • Master’s degree in Engineering or related technical field.
  • Experience leading global or cross‑site initiatives, including BKM standardization and deployment.
  • Hands‑on experience with TOR, MOR, MTEP, supplier evaluations, or H2H benchmarking.
  • Demonstrated technical leadership of engineering teams or SWAT teams.
  • Experience working directly with equipment suppliers and Global Procurement to improve capability and reduce CapEx/OpEx.

Responsibilities

  • Lead global RAM Detection strategy across RDA and Metrology, defining BKMs, roadmaps, and execution plans to improve yield, quality, cost, and learning cycles.
  • Drive cross‑site standardization by establishing, deploying, and tracking compliance to BKMs across NAND and DRAM fabs.
  • Lead Detection SWAT and Copy Smart Teams (CST), ensuring accountability to timelines, commitments, and cross‑site alignment.
  • Develop and manage indicators and fab performance metrics to benchmark performance, identify gaps, and drive continuous improvement.
  • Lead and mentor engineers by prioritizing resources, assigning work, identifying risks/opportunities, and removing execution barriers.
  • Plan and implement supplier evaluations, including demos, tool evaluations, H2H comparisons, and TOR promotions.
  • Partner with HVM, TD, Process Integration, Operations, Quality, and Global Procurement to align detection solutions with manufacturing and business needs.
  • Support global RAM governance activities including TOR, MOR, MTEP, ERM, SCM documentation, and ADCS alignment.

Benefits

  • Choice of medical, dental and vision plans
  • Benefit programs that help protect your income if you are unable to work due to illness or injury
  • Paid family leave
  • Robust paid time-off program
  • Paid holidays
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