Senior Engineer, Semiconductor Packaging

Analog Devices•Wilmington, MA

8d•$95,600 - $131,450•Onsite

About The Position

This role will focus on the development of advanced packaging solutions for semiconductor devices across multiple market segments. The packaging solutions must meet demanding product performance, reliability, manufacturability, and cost requirements. Candidates will be expected to: Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products. Perform electrical simulations of IC packages, modules, or systems using commercial simulation tools. Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues. Collaborate with OSAT partners and substrate suppliers to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield. Work with quality and reliability teams to establish reliability criteria for semiconductor products across various market applications. Develop and maintain package design guidelines, process specifications, and technical documentation.

Requirements

PhD or Master’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science.
2+ years of hands-on experience in semiconductor packaging development or manufacturing.
Good understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
Hands-on experience with electrical simulation tools such as EMPro, ADS, Sigrity, HFSS, or similar tools.
Familiarity with RLC extraction, signal integrity, power integrity, electromagnetic simulation, and circuit simulation.
Strong communication skills and the ability to work effectively in cross-functional and global teams.

Nice To Haves

Experience with Cadence Allegro is a plus.

Responsibilities

Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
Perform electrical simulations of IC packages, modules, or systems using commercial simulation tools.
Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
Collaborate with OSAT partners and substrate suppliers to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
Work with quality and reliability teams to establish reliability criteria for semiconductor products across various market applications.
Develop and maintain package design guidelines, process specifications, and technical documentation.