Senior Engineer, Semi Packaging Engineering

Analog Devices•Wilmington, MA

2d•$103,210 - $143,400•Onsite

About The Position

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. This role involves working with a cross-functional team to develop advanced integrated circuit ("IC") packaging solutions, including design, material selections, qualification, and release-to-manufacturing for various product groups. The engineer will perform component or system level mechanical stress and thermal simulations, manage projects through development of design iterations, substrate layout/simulation, assembly of prototype, and qualification. Additionally, the role requires documenting manufacturing process flows and control plans for IC packages at external suppliers, and working with quality and reliability groups to establish reliability criteria and qualification plans for various end applications. Effective communication of complex engineering ideas to global teams is essential.

Requirements

Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, Autonomy and Robotics Engineering, or related field (willing to accept a foreign education equivalent).
Two (2) years of experience as a Packaging Engineer or related occupation conceptualizing and productizing semiconductor devices to bridge analog signals to digital Cloud.
Demonstrated Expertise (“DE”) performing deep dive in 3D CAD tools (SolidWorks) and FEA software ANSYS.
DE performing semiconductor IC or electronics assembly.
DE in IC package design, optimization, and manufacturing.
DE in IC package reliability requirements, failure analysis techniques, or assembly process issues.
DE manufacturing control plan, process failure mode and effects analysis (FMEA), process change notification (PCN), statistical process control (SPC), and design of experiment (DOE).
DE in CAD tools such as Autocad.

Responsibilities

Work with cross-functional team to develop advanced integrated circuit ("IC") packaging solutions that include design, material selections, qualification, and release-to-manufacturing for various product groups.
Perform component or system level mechanical stress and thermal simulations.
Manage projects through development of design iterations, substrate layout/simulation, assembly of prototype, and qualification.
Document manufacturing process flows and control plans for IC packages at company’s external suppliers.
Work with quality and reliability groups to establish the reliability criteria and qualification plan for various end applications.
Communicate complex engineering ideas to global teams simply and effectively, as rooted in engineering principles.