Senior Engineer, Product Engineering (Mfg.)

Analog Devices•Beaverton, OR

22h•Hybrid

About The Position

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™. This role involves managing new product introduction and volume production support engineering for specific products after their transfer from design to in-house or outsourced production. The engineer will interface with various engineering teams to resolve product and production issues as products move through their lifecycle. Responsibilities include developing and sustaining process improvements to reduce costs and increase yields, conducting root cause analysis for low yield issues, and performing detailed data and circuit analysis. The position also involves utilizing precision measurement equipment, performing physical failure analysis, and driving preventive actions to improve test, design, and processes for optimal quality and cost.

Requirements

Master’s degree in Electrical Engineering, Materials Science, Device Physics, or a closely related technical discipline (willing to accept foreign education equivalent).
Two (2) years of experience as a Product Engineer or related occupation performing mixed signal circuit debugging and physical failure analysis.
Demonstrated Expertise (DE) analyzing manufacturing statistics using Klarity ACE, Galaxy Examinator, and PDF Solutions Exensio to perform correlation analysis between fab process data and yield, and pareto analysis to identify the top failing events.
DE performing mixed integrated circuit (IC) and modeling and simulation using Cadence, Avalon, Console, and Advanced Design System (ADS).
DE performing evaluation and characterization using bench test equipment including signal generators, spectrum analyzers, oscilloscopes, and power meters controlled and automated by Python, LabView, TestStand, or other programming languages.
DE performing failure analysis of analog/mixed signal integrated circuits by conducting fault isolation using techniques such as OBIRCH, EMMI, X-Ray and Thermal Hotspot and leveraging principles of semiconductor device physics and transistor level analog circuit.
DE performing mechanical and chemical de-processing, parallel polishing, utilizing high-resolution scanning electron microscope (SEM) and focused ion beam (FIB) and related techniques such as passive voltage contrast (PVC), Energy-dispersive X-ray spectroscopy (EDX), and in-situ nanoprobing to characterize and interpret the microstructure and material properties of the semiconductor device.

Responsibilities

Manage new product introduction and volume production support engineering for a specific product or group of products after transferring from design to in-house or outsourced production.
Interface with design, process, test, reliability, and manufacturing engineering to solve product issues and production problems as the product(s) move from design and development, to completion, release, and high-volume production.
Develop and sustain process improvements to reduce production costs and increase yields.
Conduct low yield root cause analysis for volume production products, process transfer and product transfer between fabrications.
Define problems by identifying failure modes, quantity of material affected, percent fallout, and financial impact.
Perform data analysis on yield, test data, and fabrication electrical device data and tool data using statistical data analysis software or self-developed program.
Perform circuit analysis on a variety of analog and mixed signal integrated circuits by using electronic design tools.
Utilize precision measurement equipment and apply measurement techniques and tools required to establish different analog, power, RF, or digital performance metrics to evaluate and collect measurements of device operations to validate the failures.
Perform fault isolation and physical failure analysis to determine the root cause from material perspective.
Drive future preventive action and solution: improve test, design, and processes to achieve the best quality and the lowest cost.