Senior Engineer II - Physical Design

Microchip Technology Inc.•Chandler, AZ

4d•Onsite

About The Position

Microchip’s DSPIC Business Unit is seeking a skilled and experienced Physical Design Engineer to join our global DSPIC Physical Design team. In this role, you will be instrumental in driving the successful execution of microcontrollers and microcontroller-based SOC designs, delivering the next generation of hierarchical, low power, mixed signal microcontroller solutions. Microchip Technology Inc. is a global leader in designing and manufacturing microcontrollers, semiconductors, and related products. We are committed to innovation, employee development, and creating a culture of trust, empowerment, and diversity. Join our team of 17,000 dedicated professionals and contribute to the technology that powers the world.

Requirements

Bachelor of Engineering in Electrical / Electronic Engineering or Master of Engineering in Electrical / Electronic Engineering or Equivalent
Minimum of 5 years of hands-on experience in Physical Design and related technical areas, demonstrating a strong track record of successful project execution.
Advanced knowledge of place and route methodologies, as well as low power physical design flows and methodologies.
Proficiency with industry-standard physical implementation and analysis tools such as Innovus or Fusion Compiler, Calibre, Redhawk, Starrcxt, or equivalent EDA tools.
Strong scripting skills in TCL, PERL, and Shell, along with working knowledge of hardware description languages such as Verilog and VHDL.
Excellent analytical and debugging abilities, with a proactive approach to identifying and resolving technical challenges.
Independent, self-motivated, and capable of managing responsibilities.
Outstanding oral and written communication skills, with the ability to clearly convey technical concepts and collaborate effectively within a team.

Nice To Haves

Familiarity with advanced nodes is desirable.

Responsibilities

Implement complex mixed signal, low power designs using state-of-the-art FLASH process technologies.
Work independently and efficiently on assigned project responsibilities, from new design exploration through delivery of GDS (netlist to GDSII flow) and Metal-only ECO implementation.
Provide Physical Design support for test chip shuttles, including development work associated with new concepts and flow.
Develop and enhance Physical Design flow and methodology, including comprehensive documentation.
Conduct power integrity and reliability analysis, ensuring robust sign-off for all designs.
Conduct floorplan exploration and optimization for accurate die size estimation.
Perform power domain and voltage area-based floor planning, including power grid planning and implementation.
Execute placement and optimization with a focus on timing, area, and power efficiency.
Manage clock tree synthesis, balancing, and debugging to ensure robust clock distribution.
Drive post-route timing optimization and timing closure to meet design specifications.
Perform timing and signal integrity analysis at both chip and block levels.
Ability to lead chip and block level physical implementation activities.
Develop and refine physical design flow and methodology for improved efficiency and quality.
Conduct physical verification, including DRC (Design Rule Check) and LVS (Layout Versus Schematic).
Ensure IR drop and electromigration (EM) signoff for reliable power delivery.
Implement timing and metal-only ECOs (Engineering Change Orders) as needed.
Interface with internal and external IP teams, as well as CAD vendors, to resolve technical issues.
Collaborate closely with synthesis, DFT, and other cross-functional global teams to achieve timely tapeout and ensure first-pass working silicon.