About The Position

In this role, you'll apply your expertise to help train next-generation AI systems. Your work will shape how models learn, reason, and perform through high-quality, real-world input. No prior experience in AI is required — your domain knowledge is what matters.

Requirements

  • IPC 610 & IPC 620 Inspection
  • PCB CAM & Gerber Review
  • SMT/AOI Defect Analysis
  • Counterfeit Parts Detection (AS6081)
  • Semiconductor Package Inspection (C SAM and X ray)

Nice To Haves

  • 8+ years of hands-on experience in electronics quality, CAM engineering, or failure analysis, specifically within PCB assembly, wire harness, or semiconductor packaging domains.
  • Extensive expertise in IPC-A-610 and IPC/WHMA-A-620 inspection criteria; IPC CIS/CIT certification strongly preferred.
  • Demonstrated experience reviewing Gerber data and utilizing PCB CAM software for manufacturability and quality assurance.
  • Proficiency in SMT processes, AOI defect analysis, and remediation of false calls in automated inspection systems.
  • Direct involvement in counterfeit component screening per AS6081, with knowledge of risk indicators and mitigation strategies.
  • Hands-on skills with semiconductor inspection tools such as C-SAM and X-ray, alongside familiarity with MIL-STD-883 procedures.
  • Exceptional written and verbal communication skills, ensuring clarity in documentation and knowledge transfer.

Responsibilities

  • Review and evaluate PCB CAM and Gerber files for manufacturability, quality, and compliance with industry standards.
  • Perform IPC 610 and IPC 620 visual inspections and provide detailed feedback on PCB assembly or wire harness builds.
  • Analyze and document surface mount (SMT) and automated optical inspection (AOI) defect types, including the identification and root cause analysis of AOI false calls.
  • Apply expertise in counterfeit electronic part detection aligned with AS6081 standards, delivering actionable insights for risk mitigation.
  • Conduct and interpret advanced semiconductor package inspections using C-SAM and X-ray imaging, including die inspection and MIL-STD-883 compliance checks.
  • Prepare concise, well-written reports and articulate findings verbally to both technical and non-technical stakeholders.
  • Collaborate with project leads to refine workflow processes and enhance training datasets for AI development.
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