Senior Electrical Manufacturing NPI Engineer

Arista Networks•Santa Clara, CA

1d•$140,000 - $175,000

About The Position

We are seeking a highly experienced and strategic Senior Electrical Manufacturing New Product Introduction (NPI) Engineer to lead the manufacturing readiness and transfer for our most complex data center networking equipment, including high-speed switches, routers, and optical transport gear. This role requires deep technical expertise in high-speed signal integrity (SI), high-density electronics, exceptional cross-functional leadership, and a proven track record of successfully bringing multiple high-volume, high-quality products from design concept to mass production within aggressive data center deployment schedules.

Requirements

Bachelor's degree in Electrical Engineering, Manufacturing Engineering, or a related technical discipline.
5+ years of progressive experience in a manufacturing engineering role, with a minimum of 3 years dedicated to NPI and successful high-volume product launches specifically within the data center networking equipment industry (e.g., switches, routers, accelerators)
Expert-level knowledge of high-layer count PCBA manufacturing, specialized soldering/rework for BGA/FC-BGA components, and process control for large-format electronic boards.
Proven track record in designing and qualifying production Functional Test (FT) systems and managing test coverage for complex network systems.
Demonstrated expertise in applying advanced statistical and quality tools (PFMEA, SPC, DOE).

Nice To Haves

Master's degree preferred.
Direct experience managing manufacturing processes at global Contract Manufacturers (CMs) or ODMs specializing in complex networking/telecom equipment.
Practical, hands-on experience in manufacturing and testing of systems incorporating water cooling, liquid cooling, or immersive cooling solutions for network processors.
Experience with specialized test equipment and analysis techniques related to Signal Integrity (e.g., TDR, VNA), optical power, and high-speed data transmission.
Fluency in advanced data analysis tools (e.g., JMP, Python for statistical analysis).
Exceptional leadership, communication, and negotiation skills, with the ability to influence technical and executive stakeholders in a fast-paced technology environment.

Responsibilities

Lead and own the entire manufacturing readiness process for complex, next-generation data center networking products (e.g., core/spine switches, specialized line cards).
Drive strategic planning for production line layout, capacity modeling, and capital equipment procurement, ensuring rapid ramp-up to support hyperscale demand.
Define and maintain the manufacturing technology roadmap, identifying and implementing new processes and equipment required for advanced packaging of ASICs/FPGAs, high-current components, and extremely high-layer count PCBs critical for signal integrity.
Function as the DFX expert, leading in-depth design reviews (DFM, DFA, DFT) and influencing product architecture to maximize yield, quality, and cost-efficiency at high volume.
Drive specialized DFX considerations for high-speed interconnects (400G/800G+), optical modules (QSFP/OSFP), and sensitive RF paths.
Expertise in managing the manufacturing and testing of complex thermal solutions is essential, particularly advanced water cooling/liquid cooling systems (e.g., cold plates, manifolds) necessary for high-TDP network processors.
Drive component selection and supplier process audits with a focus on high-reliability components and precise clocking/timing circuits.
Architect and implement robust manufacturing processes and System-Level Functional Test (FT) strategies (e.g., traffic generation and analysis, full line-rate testing, high-temperature burn-in) that achieve Six Sigma-level quality standards.
Oversee the full lifecycle of Automated Test Equipment (ATE) development, ensuring precise measurement of BER (Bit Error Rate) and signal quality while aligning with fleet deployment requirements and system diagnostics.
Provide expert-level Sustaining Engineering guidance to resolve persistent, complex issues related to signal integrity degradation, optical module failures, and system-level performance loss post-launch.