Senior Electrical Engineer (Embedded Systems)

Siemens Healthineers

4d•$165,490 - $227,546•Hybrid

About The Position

We are developing our next-generation flagship diagnostic analyzers — complex, multi-board embedded systems that directly impact care for patients globally. We’re looking for a Staff-level Electrical Engineer to serve as a technical authority and systems-minded electrical SME across embedded hardware development. This is a high-impact individual contributor role (no formal people management) with strong influence over system architecture, technical decision-making, and the success of internal + external development execution. You will collaborate closely with a small internal engineering team and partner with external development firms, contract manufacturers, and cross-functional stakeholders.

Requirements

Bachelor’s degree (or higher) in Electrical Engineering or related field.
Significant experience (typically 8+ years) delivering embedded hardware in complex products.
Demonstrated system-level ownership: electrical architecture, subsystem partitioning, interface definition, and integration across multiple boards.
Strong design fundamentals across mixed-signal embedded systems (analog + digital + power).
Experience collaborating with external design partners and/or suppliers; comfortable driving technical accountability without direct authority.
Working knowledge of DFX practices: DFM/DFA/DFT, testability, and manufacturing robustness.
Ability to communicate clearly across disciplines (systems, firmware, mechanical, assay/chemistry, manufacturing, quality).

Nice To Haves

Experience in regulated industries (medical devices strongly preferred, but not required).
Familiarity with design controls and documentation expectations in regulated environments.
Experience with relevant compliance constraints (helpful): IEC 60601, IEC 61326 / EMC, safety/EMI risk mitigation.
Embedded Linux platforms (Yocto-based workflows a plus)
SoC/SoM integration (NXP i.MX or similar)
FPGA + MCU partitioning and interface strategies
Precision analog (ADC front ends, low-noise design, calibration concepts)
Motion control and/or fluidics control subsystems
Experience supporting manufacturing test strategy (functional test architecture, fixtures, diagnostics, coverage).
Experience navigating component obsolescence, second-sourcing strategy, and design changes.

Responsibilities

Lead and/or co-lead definition of the electrical architecture for complex multi-board embedded systems (power domains, partitioning, isolation strategy, interfaces, grounding, mixed-signal considerations).
Serve as the internal technical approver for electrical design decisions and reviews (schematics, layout constraints, interface definitions, power integrity, SI/EMI risk controls).
Provide hands-on mentorship and technical direction to other electrical and systems engineers.
Work in close partnership with an external development partner (shared ownership model) to challenge assumptions, drive design quality, and ensure alignment to product and regulatory needs.
Represent engineering with PCBA manufacturers on design-for-assembly/test topics, yield issues, test strategy, and manufacturing escalations.
Support technical evaluation of manufacturing test approaches (functional test, boundary scan/JTAG where applicable, fixture strategy, test coverage and diagnostics).
Drive design decisions spanning mixed-domain and mixed-criticality subsystems: high-precision analog measurement, motion control, fluidics control (pumps/valves), sensors, and real-time orchestration.
Collaborate with firmware/software teams on embedded platform integration: Linux (Yocto) on Cortex-A class SoCs/SoMs (i.MX family likely), plus MCU and FPGA (Intel/Altera Cyclone-class) involvement.
Define robust internal interfaces (SPI/I²C/UART/Ethernet/USB/CSI/LVDS/MIPI, etc.) and reliability/diagnostic strategies suitable for a regulated medical environment.
Provide escalation support for on-market products when issues exceed the capability of the typical sustainment/offshore team (manufacturing failures, field complaints, supplier issues, design changes/obsolescence).