Senior Director, Design Manufacturing Solutions (DMS) Business Unit

Tokyo Electron•Austin, TX

11d•Hybrid

About The Position

The Senior Director is responsible for leading the strategic, technical, operational, and financial performance of the DMS organization. This senior leader will oversee end-to-end ASIC development programs, including architecture, RTL design, verification, physical design, DFT, IP integration, silicon bring-up, and customer engagement. The role requires a balance of business leadership and deep semiconductor expertise to drive successful delivery of complex SoC and ASIC solutions while ensuring operational excellence, customer satisfaction, profitability, and organizational growth. The successful candidate will possess an entrepreneurial mindset and collaborate with the team to formulate the vision, strategy, and execution framework for the DMS Business Unit, building high-performing global teams and fostering strong partnerships with customers, foundries, EDA vendors, ecosystem partners, and internal stakeholders.

Requirements

Bachelor's degree in Electrical Engineering, Computer Engineering, Business, Marketing, or related field.
20+ years of semiconductor industry experience with significant ASIC or SoC development expertise.
8+ years of leadership experience managing large engineering organizations and senior technical leaders.
Proven track record delivering multiple successful ASIC or SoC programs from concept through production.
Deep understanding of ASIC development flows.
Strong customer-facing experience supporting strategic engagements and executive-level discussions.
Demonstrated ability to drive organizational transformation and scale engineering teams.
Entrepreneurial mindset to launch a new business model.

Nice To Haves

Master's degree or Ph.D. in Electrical Engineering, Computer Engineering, Business, Marketing, or related discipline.
Experience with advanced process nodes (5nm, 3nm, and beyond) in ASIC design or Foundry-interfacing role.
Familiarity with AI/ML accelerators, networking, automotive, wireless, HPC, or data-center semiconductor solutions.
Global leadership experience managing geographically distributed teams, especially in the Asia-Pacific region.
Experience with semiconductor outsourcing, design services, or ASIC business models.
Strong understanding of commercial contracts, statements of work (SOWs), and customer program governance.

Responsibilities

Business Leadership & Strategy: Lead the execution of the long-term strategy, roadmap, and growth objectives to launch a new business model for TEL. Own business performance, including revenue, profitability, operational metrics, resource utilization, and customer satisfaction. Partner with executive leadership to identify new market opportunities, strategic investments, and technology initiatives. Develop business cases and investment plans for new design capabilities, methodologies, and technology nodes. Lead organizational planning, workforce strategy, and succession planning initiatives. Report and advocate for DMS to executive leadership in the US and Japan.
Engineering Leadership: Oversee all phases of ASIC and SoC development from concept through production release. Lead multidisciplinary engineering teams across: System Architecture, RTL Design, Functional Verification, Physical Design, Design for Test (DFT), Timing Closure, Power and Performance Optimization, Silicon Validation & Device Characterization, Test HW & SW development.
Program Management: Drive adoption of industry best practices, design methodologies, automation, and quality standards. Ensure successful tape-outs and product launches across advanced process technologies for multiple foundries.
Customer & Commercial Management: Serve as executive sponsor for strategic customer relationships and key programs. Collaborate with sales, marketing, and business development teams to drive revenue growth and expand customer engagements. Support customer acquisition activities, including technical presentations, proposal development, solution architecture, and contract negotiations. Ensure customer expectations are met through effective communication, risk management, and successful program execution.
Program & Operational Excellence: Establish program governance, development processes, and operational metrics. Manage program schedules, P&L, budgets, staffing plans, and resource allocation while maintaining cost-efficiency. Identify and mitigate technical, operational, and business risks. Drive continuous improvement initiatives focused on productivity, quality, cycle-time reduction, and cost optimization. Ensure compliance with quality, security, safety, and regulatory requirements where applicable.
Talent Development: Recruit, develop, and retain top engineering and management talent. Build a culture of innovation, accountability, collaboration, and technical excellence. Mentor senior sales, marketing, and engineering leaders and cultivate future leadership capabilities within the organization. Foster employee engagement and professional growth across global teams.
Industry & Technology Leadership: Monitor emerging semiconductor technologies, market trends, and competitive developments. Build strategic relationships with foundries, IP providers, EDA vendors, and ecosystem partners. Promote innovation and intellectual property development within the organization. Represent the company at customer, industry, and executive forums.