Senior Automotive Hardware Architect

StellantisDetroit, MI

About The Position

The Senior Automotive Hardware Architect will be responsible for driving the hardware architecture and semiconductor component selection/decision for next-generation In-Vehicle Infotainment (IVI) systems, Telematics, ADAS, and High-Performance Computing (HPC) platforms. This role requires specialized knowledge in selecting and recommending next-generation semiconductor solutions for automotive systems, ensuring high-quality and seamless integration with vehicle technology. The architect will work closely with vehicle Architecture/System Design, safety engineers, and buyers to ensure components meet performance, reliability, and cost requirements. The position involves providing technical expertise in various electronic components, automotive safety standards, and collaborating with silicon vendor partners. The role also supports HW Engineering groups, drives HW architecture decisions for automotive computing systems, and provides expertise in MCU/MPU/SoC internal architecture, ARM, RISC-V, AI/ML, networking, and security implementations. Collaboration within a Scaled Agile product delivery team and understanding Stellantis Domain team requirements are key aspects of this role.

Requirements

  • Bachelors Degree in Electrical/Electronics, Telecommunication, or equivalent Engineering discipline.
  • Minimum 10 years of experience in automotive embedded electronics designs or hardware/system architecture role.
  • Knowledge/Experience of IVI, Audio system, Automotive vehicle connectivity systems, ADAS/HPC and ECU design, development, and testing.
  • Justified experience in ARM 32/64bits architecture, power management, high speed interfaces, memories, data networking (ETH, CANxx, LIN...).
  • Strong teamwork spirit; excellent oral and written communication skills; ability to work independently in a global team environment.
  • Familiarity with relevant automotive safety and quality standards, such as ISO 26262 and AEC-Q100.
  • Experience with acoustic measurement instruments, Familiar with audio data acquisition, analysis systems and Audio Precision.

Nice To Haves

  • Experience in industrial or automotive (preferred) area (TIER1, TIER2).
  • Experience in RISC-V architecture, AI/ML, hypervisor technologies is a plus.
  • Experience in software engineering and software architecture development.
  • Knowledge of safety standards including ISO 26262, Euro NAP, and Security regulations.
  • Solid understanding of embedded electronics design constraints at the component and system level.
  • Understanding and knowledge of Board software/Bring up software, Audio DSP and MCUs.
  • Be curious.
  • Ability to think outside-the-box in high pressure situations.
  • Ability to multi-task.
  • Detail oriented problem-solver.
  • Self-starter with the ability to work independently given minimal supervision.
  • Ability to work in a team environment and be both a team player and task leader.
  • Respect and understanding of the Customer/Supplier relationship while embracing partnership.
  • Ability to present concepts/strategies/project status to large groups.

Responsibilities

  • Drive the HW architecture and semiconductor component selection/decision for next generation IVI, Telematics, ADAS, HPC platforms.
  • Select and recommend next generation semiconductor solutions for automotive IVI/ADAS/HPC systems, electronics/ECU designing and developing electronic components and systems.
  • Work closely with vehicle Architecture/system Design, safety engineer & Buyer/purchasing ensuring that the chosen components meet the performance, reliability, and cost requirements.
  • Recommend and propose the right electronic components including Display technology, Cluster technology, Audio amplifiers, MCU/MPU, SIP/SOC, Memories (UFS, LPDDR, Flash), Microphone interface/Audio ADC, Audio DSP, Audio power circuitry/PMIC, Speaker interface, Digital audio interfaces (A2B, Ethernet, etc.), ANC and RNC design.
  • Work proactively with silicon vendor partners to drive design features and technology road map.
  • Support HW Engineering group during advanced design phases, system architecture definitions and ECU development.
  • Drive the HW architecture decision for the next Stellantis automotive computing system/hardware architecture, considering key KPIs for scalable, reusable and cost-optimized platforms.
  • Provide technical expertise in MCU/MPU/SoC Internal Architecture to maximize ECU Hardware design efficiency/performance in areas of Body, Propulsion, Chassis, Gateway, Zone, ADAS and Infotainment.
  • Provide technical expertise for ARM, RISC-V, HW accelerations, Neural network processing, Video decode/encode, Image processing, Audio processing, Camera & Display, Networking, and advanced memory technologies.
  • Provide technical expertise for best-in-class ISO26262 and Cyber security implementation.
  • Support discussions between HW Engineering and Semiconductor groups for High level MCU/MPU/SoC specifications for IVI/ADAS/HPC systems.
  • Support MCU/MPU/SoC/IVI technology roadmap definitions by regularly providing survey study of relevant industry technologies and chip solutions.
  • Collaborate in a Scaled Agile product delivery team, comprised of cross-functional company peers to continuously prioritize, refine, and deploy components.
  • Understand Stellantis Domain team requirements, project milestones, and technology relevance.
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