Senior ASIC Physical Design Engineer

Tensordyne•Sunnyvale, CA

12h

About The Position

Tensordyne is an AI system solution company that builds very high-performance, low-power generative AI inference systems. Our mission, through the creation of custom silicon, hardware and software, is to enable multimodal Generative AI inference acceleration at scale, with safe, sustainable, high-performance systems for our hyperscaler and neocloud data center customers. We are at the leading edge of advancing the latest research and product improvements for generative Al inference solutions that will make Al even more advantageous for compelling new generative AI applications. Tensordyne is a well funded, fast-paced startup company with headquarters in both Sunnyvale, CA, and Munich, Germany. We also have many talented team members working remotely across North America and Europe. We take care of our people and their families with comprehensive benefits, competitive compensation, flexible spending options, and recognition programs, because building category-defining technology starts with a healthy, supported team. Come join us as we shape the future of multimodal generative artificial intelligence! In this leadership role, you will lead ASIC front-end physical design and associated engineering workflow development for Tensordyne’s multimodal generative AI inference acceleration products. As a valued senior member of our ASIC team, you will guide and assist your colleagues to help improve frontend physical design aspects at both the block level and full-chip within a fast-paced, agile HPC development environment that utilizes EDA tools from external companies like Cadence/Synopsys and as well as internally developed workflows. You will drive Tensordyne’s optimization, implementation and exploration of new frontend physical design workflows (includes at a min. synthesis, formal checks, and power analysis, and provide guidance for STA) and technologies for the full ASIC chip design process. Your contributions will continuously innovate and improve scalable, reliable, high-performance systems and tools to enable the next generation of Tensordyne products. This is a hands-on role that’s ideal for ASIC physical design experts who have a multi-disciplinary engineering background, along with a keen interest in generative AI, and a passion for designing, debugging, optimizing and finding creative EDA solutions to complex technical challenges. In this role, you will work very closely with your ASIC team members who are engaged in the design and verification of Tensordyne products, to understand and improve their workflows and EDA needs.

Requirements

10+ years of hands-on ASIC engineering experience, that includes deep knowledge of VLSI/SoC chip physical design workflows, with EDA tools like Cadence/Synopsys (Genus/DC), power analysis, clock methodology, and other commonly used aspects of physical design flows
Strong physical design knowledge for front-end optimization using standard EDA tools
Experience leading and supporting backend design team with understanding of clock trees, routing , DRC, LVS, metal fill till artwork release.
Understanding of STA analysis and constraints for block level and knowledge of full chip timing analysis
Excellent analytical, written, and verbal interpersonal skills along with an ability to productively collaborate within a global engineering team that moves at a startup pace.
Bachelor’s or Master's degree in Computer Science, Computer Engineering, Electrical Engineering or a related technical field

Responsibilities

Lead ASIC front-end physical design and associated engineering workflow development for Tensordyne’s multimodal generative AI inference acceleration products.
Guide and assist colleagues to improve frontend physical design aspects at both the block level and full-chip.
Drive Tensordyne’s optimization, implementation and exploration of new frontend physical design workflows (includes at a min. synthesis, formal checks, and power analysis, and provide guidance for STA) and technologies for the full ASIC chip design process.
Continuously innovate and improve scalable, reliable, high-performance systems and tools to enable the next generation of Tensordyne products.
Work closely with ASIC team members engaged in the design and verification of Tensordyne products, to understand and improve their workflows and EDA needs.