Semiconductor Operations - SiP Productization

Apple • Cupertino, CA

3d

About The Position

The Apple Semiconductor Operations team is looking for a motivated, highly technical Component SiP productization engineering focusing on product and process development, supplier readiness, and high-volume manufacturing quality. This role will drive NPI execution, process bring-up, qualification readiness, and quality improvement for advanced SiP, RF, antenna, mmWave, wireless, and high-density module technologies. The successful candidate will work with module integration suppliers, OSATs, sub-component vendors, PCB/substrate suppliers, and system integration sites. They will interface regularly with Engineering, Operations, Reliability, and Quality teams.

Requirements

• Strong SiP, semiconductor packaging, module assembly, or advanced packaging experience, including knowledge of assembly processes, materials, substrates, and package-level failure mechanisms.
• 5+ years relevant experience in product engineering, process engineering, semiconductor packaging, module productization, supplier quality, or high-volume manufacturing.
• MS/BS in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or related technical discipline
• Understanding of SPC, DOE, FMEA, JMP or equivalent data analysis tools, and factory quality metrics used to monitor production performance.
• Strong understanding of reliability testing and failure mechanisms such as temperature cycling, board-level reliability, MSL, bHAST, CAF, warpage, solder fatigue, and substrate/material interactions.
• Strong interpersonal skills to work with design, development, operations, reliability, quality, supplier engineering, and other cross-functional teams.

Nice To Haves

• Hands-on experience with supplier manufacturing process control, quality systems, factory audits, and production readiness reviews.
• Experience with RF, mmWave, antenna module, wireless module, high-density package, or advanced SiP architecture is a plus.
• Self-motivated, good communicator, and able to lead complex issues across global suppliers.

Responsibilities

• Drive NPI execution, process bring-up, qualification readiness, and quality improvement for advanced SiP, RF, antenna, mmWave, wireless, and high-density module technologies.
• Work with module integration suppliers, OSATs, sub-component vendors, PCB/substrate suppliers, and system integration sites.
• Interface regularly with Engineering, Operations, Reliability, and Quality teams.
• Take advanced packages or modules from concept and development builds to high-volume manufacturing.
• Communicate technical risk clearly, drive issue closure, and provide concise executive-level updates.
• Lead complex issues across global suppliers.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior