Semiconductor Die Fab Process Engineer

Keysight Technologies, Inc.•Santa Rosa, CA

2h•Onsite

About The Position

Keysight Technologies, the world's premier measurement company, has an opening for a Semiconductor Fab Process Development Engineer at the High Frequency Technology Center in Santa Rosa, California. Live in beautiful Sonoma County amongst vineyards, redwood forests, rivers, lakes, and coastline while working on state-of-the-art ICs and devices. Semiconductor Process Development Engineers at HFTC are responsible for advanced process development and sustaining of custom, cutting edge, micro and nano-fabrication technologies for high performance microwave and millimeter-wave applications. The technologies include InP and GaAs-based HBTs, HEMTs, diodes, BOLT, and other advanced electronic components which enable key competitive differentiation of Keysight’s industry-leading RF, microwave, and high bit rate instruments. The focus of this position is on Die Fab & Backside processes for current and future MMIC products, as well as advanced high frequency packaging development. These processes include MMIC wafer thinning, wafer separation (laser & saw), chip sort, visual inspection, outgoing quality, and heterogeneous integration of high frequency components.

Requirements

B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or equivalent experience.
5+ years of experience in advanced semiconductor processes and devices is required.
Experience with statistical process control and design of experiments is required.
Candidates must have strong problem-solving and analytical skills, as well as excellent interpersonal and communication skills for successful inter and intra-group interactions.
Must have strong self-initiative and proactive attitude.
Candidates must be local or willing to relocate to Santa Rosa area.
This position requires access to certain goods, software, technology, or technical data subject to U.S. export control laws and regulations. Candidates must be a U.S. citizen or lawful permanent resident of the U.S., or protected individual, having authorization from the U.S. government for export-controlled items under 8 U.S.C. 1324b(a)(3).

Nice To Haves

Previous experience in the following areas is highly desired: Heterogeneous integration and advanced packaging & assembly techniques, MMIC wafer thinning and Die Fab operations such as wafer grinding/polishing, laser separation, saw dicing, chip sort, auto-visual inspection, and other backend processes.
specific skills in III-V semiconductor processing is highly preferred.

Responsibilities

Driving heterogeneous integration process development projects that are critical to Keysight’s high frequency packaging roadmap.
Ownership of Die Fab processes and equipment to drive production sustaining, continuous improvement, and R&D activities.
Work closely with other process, integration, product, and circuit design engineers to define process and device performance targets.
Define process flows and develop new fabrication processes and drive optimization to maximize product yield.
Ensure successful transfer and maintenance of new technologies in manufacturing. Project objectives will encompass performance, reliability and manufacturing goals.
Collaborate with Operations Group to implement robust process control; diagnose and resolve process problems.
Lead capital equipment acquisition projects that include tool evaluation, characterization, process development and qualification.