Engineer, Semi Packaging Engineering

Analog Devices•Wilmington, MA

11d•$75,200 - $103,400•Onsite

About The Position

Analog Devices (ADI) is seeking a Semi Packaging Engineer to join their team. This role is responsible for the development of advanced packaging solutions for semiconductor devices across various market segments. The packaging solutions must meet demanding product requirements while balancing reliability, manufacturability, and cost. Candidates will be expected to lead the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products. They will also provide technical leadership in package mechanical and thermal analysis, work closely with cross-functional teams, collaborate with OSAT partners, substrate suppliers, and material vendors, and work with quality and reliability teams to establish reliability criteria and qualification plans. Additionally, the engineer will develop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.

Requirements

Master’s degree in Mechanical Engineering or Electrical Engineering.
2+ years of hands-on experience in semiconductor packaging development, package simulation, or packaging manufacturing.
Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
Strong analytical, problem-solving, communication, and collaboration skills.
Ability to work effectively in cross-functional teams and influence technical decisions across organizations.

Nice To Haves

Experience with ANSYS, FloTHERM, Sigrity, or Icepak is a plus.
Experience with SolidWorks or AutoCAD is a plus.

Responsibilities

Lead the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
Provide technical leadership in package mechanical and thermal analysis to support package architecture selection, design optimization, and reliability risk assessment.
Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
Collaborate with OSAT partners, substrate suppliers, and material vendors to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
Work with quality and reliability teams to establish reliability criteria and qualification plans for semiconductor products across various market applications.
Develop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.