SAW Process Engineer – MEMS & Microfluidics Manufacturing

HP•Corvallis, OR

3d•Onsite

About The Position

The SAW Process Engineer is responsible for the development, qualification, and sustainment of wafer dicing and singulation processes used to separate silicon and other substrates into individual die. This role provides technical ownership of precision mechanical cutting processes within a MEMS and microfluidics manufacturing environment and plays a critical role in ensuring yield, quality, and product reliability in high‑volume production. The position requires strong expertise in mechanical process engineering, brittle material handling, and manufacturing process control, with direct accountability for process stability, defect reduction, and continuous improvement.

Requirements

Bachelor’s degree in Mechanical Engineering (preferred), Materials Science, Manufacturing Engineering, or a related engineering discipline.
3–5 years of process engineering experience in semiconductor, MEMS, or microfluidics manufacturing.
Demonstrated hands‑on experience with wafer dicing / singulation (SAW) processes, including precision mechanical cutting of brittle materials.
Experience supporting high‑volume manufacturing environments with strong focus on yield, quality, and process stability.

Nice To Haves

Experience with silicon wafer singulation, thin wafers, and multi‑layer or bonded substrate stacks.
Understanding of mechanical stress, fracture mechanics, and damage modes associated with material removal processes.
Experience implementing process controls, SPC, and structured problem‑solving methodologies.
Familiarity with operating in cleanroom and semiconductor fabrication environments.
Strong technical communication skills and ability to work across cross‑functional engineering and operations teams.

Responsibilities

Own and sustain wafer singulation (SAW/dicing) processes used in MEMS and microfluidics manufacturing, including silicon and multi‑layer substrate cutting.
Develop, qualify, and maintain process recipes and cutting strategies, including blade selection, cut parameters, and mechanical process windows.
Provide manufacturing process engineering support for production operations, including rapid response to yield excursions and defect trends related to singulation.
Lead root cause analysis for mechanical defects such as chipping, cracking, edge damage, delamination, or die breakage, and implement corrective actions.
Define and maintain process controls, critical parameters, and monitoring strategies to ensure consistent performance and robust manufacturing output.
Lead material, tool, and process change qualifications through formal change management and validation practices.
Support new product introduction (NPI) activities requiring new or modified singulation approaches.
Collaborate cross‑functionally with operations, quality, reliability, and product engineering teams to ensure alignment on manufacturability and risk mitigation.
Create and maintain process documentation, technical specifications, and standard work to support long‑term process sustainability.
Own production wafer and panel mounting processes, including tools, performance, and continuous improvement.
Lead qualification and implementation of new tape materials to meet product demands and ensure supply continuity.
Drive process control and development for UV-cure processes to ensure robust, scalable manufacturing.