RFIC Thermal Engineer
About The Position
Are you passionate about solving complex thermal challenges in advanced semiconductor technologies? At Falcomm, we are transforming innovative semiconductor research into real-world solutions through high-performance, energy-efficient RF power amplifier technologies. Our mission is to deliver next-generation wireless solutions that maximize performance while improving efficiency and reliability. Falcomm is seeking an RFIC Thermal Engineer to analyze, model, and optimize thermal performance in RF integrated circuits and semiconductor packages. This role will focus on understanding heat dissipation, thermal reliability, and thermal management strategies for high-power RF devices. The position requires collaboration with RFIC designers, packaging engineers, and system teams to ensure devices operate reliably under demanding performance conditions.
Requirements
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.
- 3-5 years experience with thermal analysis, modeling, or simulation in semiconductor or electronic systems.
- Strong understanding of heat transfer principles and thermal management techniques for RFICs and MMICs.
- Must be willing to work full-time, onsite, in Atlanta, GA.
Nice To Haves
- Experience with thermal simulation tools such as ANSYS, COMSOL, or similar platforms.
- Familiarity with semiconductor packaging technologies and thermal interface materials.
- Experience analyzing high-power devices such as RF amplifiers or high-frequency ICs.
- Strong analytical and problem-solving skills with the ability to collaborate across engineering teams.
Responsibilities
- Develop thermal models for RFIC devices, packages, and modules to evaluate heat dissipation and temperature distribution.
- Perform thermal simulations and analysis to support design optimization and reliability improvements.
- Collaborate with RFIC design and packaging teams to develop thermal management strategies.
- Evaluate thermal performance across different packaging technologies and materials.
- Support silicon validation and characterization related to thermal performance.
- Analyze thermal failure mechanisms and recommend design or process improvements.
- Document analysis methods, results, and recommendations.
Benefits
- Competitive Salary and Equity Package
- Comprehensive Health, Dental, and Vision Insurance
- 401(k) Retirement Plan
- Paid Time Off (PTO) and Sick Leave
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
What This Job Offers
Job Type
Full-time
Career Level
Mid Level
