RFIC Packing Engineer

MACOM Technology Solutions Holdings, Inc. • Lowell, MA

1d

About The Position

Technical lead for RFIC package development, supporting NPI from concept through production release. This individual will provide direction to product and design engineers for optimum, cost effective packaging solutions as well as providing thermal design and analysis for IC package and system level physical designs. Package types include plastic molded leadframe packages, ceramic packages, laminate packages and metal packages for RF and Microwave IC’s. We are looking for an individual who has a proven track record of managing multiple product development programs in parallel and reducing to practice on schedule in a high volume manufacturing environment.

Requirements

• MS or BS +3 years of experience in Materials Science, EE/ME with advanced IC package process development, design and thermal analysis with emphasis on RF and Microwave IC’s
• Proven track record of successfully driving package design/development activities from concept to implementation
• Experience working with high-volume contract manufacturers in developing processes or resolving technical issues
• Experience in package design and development including strong understanding of relationship between materials and package performance
• Deep knowledge of high-volume RFIC and Microwave IC assembly processes (die attach, flip chip, wafer saw, wire bond, surface mount, package singulation, etc.)
• Experience in failure analysis methodology
• Ability to work independently under tight deadlines, with strong ownership of projects
• Ability to work effectively in a multi-tasking mode
• Good written and verbal communication skills. Able to present ideas, design concepts, data and plans with high confidence at team meetings and executive review meetings
• Solid understanding and use of statistical techniques including DOE and SPC. Experience with JMP or Minitab
• Good teamwork skills in working together to achieve goals
• Knowledge of product characterization and reliability testing standards [JEDEC, IPC, EIA, RoHS, WEEE]
• Experience with Solidworks and ANSYS FEA is required.
• Experience with solving steady state and dynamic thermal and mechanical problems, using finite element analysis (FEA) software is required.

Nice To Haves

• Experience with AutoCad is a plus.

Responsibilities

• Technical lead for RF/microwave plastic, ceramic, laminate and metal packages
• Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality
• Work with vendors and internal engineering resources to establish and update design rules for packaging
• Establish and implement robust assembly processes internally and at our contract manufacturers
• Troubleshoot IC packaging defects, then define and implement solutions
• Provide supplier benchmarking and tracking data to drive backend technology roadmap
• Working with Quality organization, characterize failure modes, and analyze as a function of packaging materials and processes
• Provide thermal modeling and application notes for new packages

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 501-1,000 employees