Responsible for identifying applicable standards and test methods, developing reliability qualification plans, coordinating reliability testing, supporting failure analysis, and preparing customer-ready reliability data packages for advanced thermal management products. Lead and manage reliability test planning and execution for semiconductor packaging, liquid cold plates, T800 Thermadite, CVD diamond, thermal spreaders, embedded cooling structures, and related thermal assemblies. Identify appropriate industry standards, customer specifications, and qualification methods through technical research, benchmarking, and direct engagement with customers. Develop product- and application-specific qualification plans where standard test methods may not fully exist or directly apply. Translate customer use conditions, package requirements, liquid cooling requirements, and expected failure mechanisms into reliability test plans and acceptance criteria. Support reliability test methods including thermal cycling, thermal shock, high-temperature exposure, humidity, corrosion, pressure cycling, leak testing, coolant compatibility, mechanical fatigue, and bond/interface reliability. Coordinate with internal engineering, quality, operations, customers, suppliers, and external labs on qualification strategy, test methods, sample sizes, success criteria, and reporting format. Support failure analysis efforts and translate findings into design recommendations, process controls, corrective actions, and customer-facing conclusions. Support customer technical reviews, reliability reporting, qualification readiness reviews, and product scale-up decisions.
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Job Type
Full-time
Career Level
Senior