R&D Senior Process Engineer

Precision Neuroscience • Addison, TX

23h • Onsite

About The Position

Precision Neuroscience is building a next-generation brain–computer interface (BCI) to heal and empower millions of people living with neurological conditions. Our first product, Layer 7, is designed to help people with severe paralysis operate digital devices using only their thoughts—opening up new possibilities for daily life. Our team brings together experts in neurosurgery, AI and machine learning, microfabrication, electrical engineering, clinical science, and more. We combine deep technical rigor with a people-first mindset to turn breakthrough research into real-world medical solutions. As a Precision employee, you’ll join one of the fastest-moving and best-capitalized companies in the emerging field of brain–computer interfaces. Since our founding in 2021, we have raised more than $180 million, advanced our technology through validation, and initiated human trials with leading hospitals across the country.

Our Values:
We build for human impact, measuring progress by the lives our work can change.
We do no harm, holding ourselves to the highest standards of safety, integrity, and responsibility.
We innovate with urgency because the stakes are high and our users can’t wait.
We bring sharp minds, open ears, pairing expertise with curiosity, humility, and respect.
And we lead the way, taking ownership of our work and helping to shape the future of our field.

We are seeking a R&D Senior Process Engineer to lead the materials and MEMS manufacturing development of our neural interface technologies. This role owns the development of our thin-film based manufacturing and materials development. You will lead this work in our in-house ISO-certified MEMS facility in Addison, TX. You will span the range of technology development from early research to early production, bridging the gap from feasibility to scale-up. This position will be based in our Addison, TX office. We are unable to consider remote workers or individuals who are not currently based in the US and legally authorized to work in the US.

Requirements

• Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related field, with a research focus on thin film ceramics or dielectric materials (or M.S. with equivalent industry experience).
• 5+ years of hands-on experience with thin film ceramic deposition techniques (ALD, PECVD, sputtering, e-beam evaporation) and a deep understanding of the structure-property relationships governing film performance.
• Experience in thin film characterization methods such as ellipsometry, XRD, SEM/TEM, AFM, profilometry, and electrochemical impedance spectroscopy (EIS).
• Strong working knowledge of MEMS microfabrication processes (photolithography, dry/wet etching, metallization, wafer/substrate handling) and cleanroom experience.
• Proven ability to design and interpret test studies for evaluating encapsulation or barrier film reliability.
• Understanding of failure mechanisms in multilayer thin film stacks, including interfacial adhesion, stress management, and mechanical fatigue under flexing or cyclic loading.
• Excellent experimental design (DOE) skills and data analysis capabilities to drive process optimization decisions.
• Strong written and verbal communication skills, with experience documenting technical processes and presenting findings to cross-functional teams.

Nice To Haves

• Experience with nanolaminate or multilayer ceramic barrier stack design for moisture/ion barrier applications.
• Background in chronic in vivo or in vitro reliability testing of implantable electronics.
• Track record of peer-reviewed publications or patents in thin film ceramics, MEMS, or bioelectronics.
• Familiarity with biocompatibility and regulatory standards for implantable devices (ISO 10993, ISO13485 FDA guidance documents).
• Experience mentoring or leading small technical teams in a startup or fast-paced R&D environment.
• Familiarity with wafer-level or panel-level packaging and hermetic sealing approaches for implantable microdevices.

Responsibilities

• Lead the design and development of thin film ceramic encapsulation/insulation layers integrated with polymer films.
• Define material selection criteria and deposition strategies (ALD, PECVD, sputtering, e-beam evaporation) based on required film properties: barrier performance, dielectric strength, stress/adhesion behavior, and biocompatibility.
• Characterize film properties and analyzing data from techniques such as ellipsometry, XRD, SEM/TEM, profilometry, and electrochemical impedance spectroscopy (EIS).
• Collaborate with process engineers to integrate ceramic thin film steps into a MEMS microfabrication flow (e.g., photolithography, etching, metallization).
• Develop test structures and DOEs to systematically evaluate ceramic film performance as a function of deposition parameters, thickness, and multilayer stack design.
• Author technical reports, process documentation, and IP disclosures; present findings to internal stakeholders and, where appropriate, at scientific conferences or in peer-reviewed publications.
• Stay current with emerging thin film ceramic materials and deposition technologies relevant to implantable bioelectronics, and recommend adoption where beneficial.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: Ph.D. or professional degree