R&D Principal Engineer for Novel Materials and Integration Solutions (7997)

TSMC•San Jose, CA

18d•$130,000 - $180,000•Hybrid

About The Position

Join TSMC Technology, Inc.’s Corporate Research team in San Jose as an R&D Principal Engineer developing novel materials and integration solutions for advanced semiconductor devices and 3D structures. The role involves hands-on work in materials synthesis, thin-film deposition, cleanroom fabrication, and advanced characterization to support next-generation IC technologies. You will collaborate with internal teams in San Jose and Taiwan and university research partners to explore new materials, devices, and thermal integration approaches. The position is based in the San Jose office with a hybrid schedule requiring four days in-office, and research may take place at in-house and off-site facilities.

Requirements

Ph.D. in Physics, Materials Science, Chemistry, Electrical Engineering, or a related field.
Experience in materials synthesis and thin-film deposition using CVD, ALD, PVD, or related growth methods.
Hands-on experience with cleanroom processing, device fabrication, and characterization techniques.
Strong knowledge of materials science, surface chemistry, thin-film growth, etching, planarization, and bonding.
Ability to work independently and collaborate with cross-functional teams.

Nice To Haves

Experience in semiconductor device design, fabrication, integration, and advanced testing.
Experience with thermal characterization of materials, structures, or interfaces.
Experience setting up research equipment or programming for tool control and data collection.
Experience in data analysis and technical reporting.
Familiarity with physics-based simulation tools.

Responsibilities

Research and develop novel materials and integration solutions for future devices and IC thermal management applications.
Synthesize and deposit materials using CVD, ALD, PVD, and related techniques.
Fabricate devices and test structures using cleanroom processes such as lithography, etching, deposition, metallization, and bonding.
Characterize materials, interfaces, and devices using structural, chemical, electrical, optical, and thermal analysis methods.
Analyze experimental data and prepare technical reports.
Collaborate with internal cross-functional teams and external research partners.
Conduct research at both in-house and off-site facilities.