R&D Principal Engineer for Novel Materials and Integration Solutions (7997)

TSMC•West Covina, CA

18d•$130,000 - $180,000•Hybrid

About The Position

Join TSMC Technology, Inc.’s Corporate Research team in San Jose as an R&D Principal Engineer developing novel materials and integration solutions for advanced semiconductor devices and 3D structures. The role involves hands-on work in materials synthesis, thin-film deposition, cleanroom fabrication, and advanced characterization in support of next-generation IC technologies. You will collaborate with internal teams in San Jose and Taiwan and with university research partners to explore new materials, devices, and thermal integration approaches. The position follows a hybrid schedule with four days in the office and may involve research at in-house and off-site facilities. TSMC Technology, Inc. is an innovation hub of Taiwan Semiconductor Manufacturing Company Limited, focused on advancing semiconductor technology through research and development. The role’s posted base salary range is $130,000 to $180,000 per year. TSMC states that total compensation includes market-competitive pay, allowances, bonuses, and comprehensive benefits, and that it offers extensive development opportunities and programs.

Requirements

Ph.D. in Physics, Materials Science, Chemistry, Electrical Engineering, or a related field.
Experience in materials synthesis and thin-film deposition using CVD, ALD, PVD, or related growth methods.
Hands-on experience with cleanroom processing, device fabrication, and characterization techniques.
Strong knowledge of materials science, surface chemistry, thin-film growth, etching, planarization, and bonding.
Ability to work independently and collaborate with cross-functional teams.

Nice To Haves

Experience in semiconductor device design, fabrication, integration, and advanced testing.
Experience with thermal characterization of materials, structures, or interfaces.
Experience setting up research equipment or programming for tool control and data collection.
Experience in data analysis and technical reporting.
Familiarity with physics-based simulation tools.

Responsibilities

Research and develop novel materials and integration solutions for future devices and IC thermal management applications.
Synthesize and deposit materials using CVD, ALD, PVD, and related techniques.
Fabricate devices and test structures using cleanroom processes, including lithography, etching, deposition, metallization, and bonding.
Characterize materials, interfaces, and devices using structural, chemical, electrical, optical, and thermal analysis methods.
Analyze experimental data and prepare technical reports.
Collaborate with internal cross-functional teams and external research partners.
Conduct research at in-house and off-site facilities.