R&D Engineer
Broadcom•San Jose, CA
About The Position
The ideal candidate will have expertise in advanced packaging technology, and ‘system in package’ assembly, including manufacturability and reliability issues with wide-ranging experience in semiconductor device fabrication and operation, test development and execution, reliability failure mechanisms and testing, assembly process development and qualification, and wafer foundry manufacturing operations. Can translate system-level performance requirements into modules and collaborate directly with external foundry R&D teams, OSATs to identify and/or jointly-develop candidate technologies.
Requirements
- Broad knowledge of advanced packaging, assembly and silicon process technologies, including thermal solutions, power delivery, and both electrical and optical communication
- Experience with design of both serial and parallel interfaces both for chip-to-chip communication within module and for external module communication
- Experience with parametric and yield data analysis.
- Proficiency with statistical data analysis tools
- Experience with yield failure mechanisms and tools for root cause finding (EFA, PFA)
- Experience with thermal and stress simulation tools
- Exceptional data analysis, problem solving, and interpersonal skills
- MSEE in Electrical Engineering or related field required and 15+ years of experience in semiconductor process technology, advanced packaging and manufacturing, specifically R&D and integration roles, or PhD and 12+ years of experience in semiconductor process technology and manufacturing, specifically R&D and integration roles
Responsibilities
- Technical lead for multi chip semiconductor assembly and system pathfinding for leading-edge artificial intelligence and high-performance computing modules.
- Owns key portions of the advanced packaging and assembly, and system technology roadmap, and drives the development of new assembly technology from early R&D through new product introduction phases by close interaction with technical leads in system customer organizations and collaborating with internal IC design/validation teams and external foundry R&D groups.
- Defines technology requirements and roadmaps, evaluation and qualification plans, and provides hands-on applications support as technology transitions from process R&D to product development.
- Takes a leading role in advanced packaging technology problem solving, providing design and product enablement.
- Serves as the internal principal investigator for new technology projects.
- Capable of independent project management from concept phase through transfer to high-volume manufacturing, facilitating clear communication with external foundry & assembly collaborators, as well as internal design and validation teams throughout the project.
- Performs risk assessment and help to coordinate cross-functional technology risk mitigation for multiple projects in parallel.
Benefits
- Medical, dental and vision plans
- 401(K) participation including company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- company paid holidays
- paid sick leave and vacation time
- Paid Family Leave and other leaves of absence
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What This Job Offers
Job Type
Full-time
Career Level
Senior
