R&D Engineer

Broadcom • San Jose, CA

1d

About The Position

The ideal candidate will have expertise in advanced packaging technology, and ‘system in package’ assembly, including manufacturability and reliability issues with wide-ranging experience in semiconductor device fabrication and operation, test development and execution, reliability failure mechanisms and testing, assembly process development and qualification, and wafer foundry manufacturing operations. Can translate system-level performance requirements into modules and collaborate directly with external foundry R&D teams, OSATs to identify and/or jointly-develop candidate technologies. Typically possesses a graduate degree in electrical engineering and has several years of experience in the field.

Requirements

• Broad knowledge of advanced packaging, assembly and silicon process technologies, including thermal solutions, power delivery, and both electrical and optical communication
• Experience with design of both serial and parallel interfaces both for chip-to-chip communication within module and for external module communication
• Experience with parametric and yield data analysis.
• Proficiency with statistical data analysis tools
• Experience with yield failure mechanisms and tools for root cause finding (EFA, PFA)
• Experience with thermal and stress simulation tools
• Exceptional data analysis, problem solving, and interpersonal skills
• MSEE in Electrical Engineering or related field required and 15+ years of experience in semiconductor process technology, advanced packaging and manufacturing, specifically R&D and integration roles, or PhD and 12+ years of experience in semiconductor process technology and manufacturing, specifically R&D and integration roles

Responsibilities

• Technical lead for multi chip semiconductor assembly and system pathfinding for leading-edge artificial intelligence and high-performance computing modules.
• Owns key portions of the advanced packaging and assembly, and system technology roadmap, and drives the development of new assembly technology from early R&D through new product introduction phases by close interaction with technical leads in system customer organizations and collaborating with internal IC design/validation teams and external foundry R&D groups.
• Defines technology requirements and roadmaps, evaluation and qualification plans, and provides hands-on applications support as technology transitions from process R&D to product development.
• Takes a leading role in advanced packaging technology problem solving, providing design and product enablement.
• Serves as the internal principal investigator for new technology projects.
• Capable of independent project management from concept phase through transfer to high-volume manufacturing, facilitating clear communication with external foundry & assembly collaborators, as well as internal design and validation teams throughout the project.
• Performs risk assessment and help to coordinate cross-functional technology risk mitigation for multiple projects in parallel.

Benefits

• discretionary annual bonus
• competitive new hire equity grant
• annual equity awards
• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• company paid holidays
• paid sick leave and vacation time
• Paid Family Leave and other leaves of absence

What This Job Offers

• Job Type: Full-time
• Career Level: Senior