Quantum Superconducting Materials Engineer

GlobalFoundries•Malta, NY

4d•$143,000 - $247,000

About The Position

GlobalFoundries Fab8 is seeking an experienced R&D cryogenic / superconducting materials engineer to become part of our Quantum Advanced Packaging team. The primary responsibility of this position is to own development, selection, and integration of cryogenic and superconducting materials enabling high-performance, scalable quantum packaging technologies from concept through manufacturing.

Requirements

Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
MS degree with at least 15 years of prior related work experience.
Must have at least an overall 3.0 GPA and proven good academic standing.
English (Written & Verbal) fluency.
Up to 20% travel.

Nice To Haves

PhD education level preferred with at least 12 years of prior related work experience.
Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
Strong written and verbal communication skills.
Strong planning & organizational skills.

Responsibilities

Lead selection and development of materials systems for cryogenic and superconducting packaging, including superconducting metals (Nb, Al, NbN, etc.), interconnect materials (In, Cu, Sn-based systems), and dielectric, substrate, and bonding interface materials.
Establish material schemes compatible with millikelvin–cryogenic operating environments.
Evaluate material suitability for electrical conductivity / superconductivity, thermal conductivity / isolation, and mechanical robustness under cryogenic cycling.
Drive integration of materials into 2D, 2.5D, and 3D advanced packaging architectures.
Define material stacks and interfaces across BEOL / RDL layers, interposers and TSVs, and bump and bonding interfaces.
Ensure compatibility of materials with process flows, tools, and downstream assembly operations.
Own materials-related process integration from early development through prototyping and qualification.
Drive process development, optimization, and control plans for deposition, plating, bonding, and surface preparation.
Enable smooth movement of prototypes and development lots across fab and assembly workflows.
Develop deep understanding of temperature-dependent material properties including superconducting transitions, electrical resistivity and RF loss, thermal transport behavior, and mechanical stress/CTE mismatch.
Define and utilize characterization methods (electrical, thermal, structural) to evaluate materials performance.
Correlate material behavior with device- and system-level performance impacts.
Identify and analyze failure mechanisms, including delamination and interface failure, diffusion / intermetallic formation, and stress-induced cracking during thermal cycling.
Develop material solutions and process mitigations to enhance reliability.
Drive long-term reliability strategies for cryogenic operation.
Develop materials solutions that improve yield and process robustness, and reduce cycle time and cost.
Partner with integration teams to ensure scalable and manufacturable material choices.
Work directly with material suppliers and equipment vendors to evaluate new materials (e.g., superconducting films, hybrid materials) and define material specifications and qualifications.
Collaborate with OSATs and partners to enable wafer-level and die-level integration flows.
Interface across interconnect / bump / TSV / assembly integration teams, and device / qubit / system engineering teams.
Enable co-optimization of materials + process + system architecture.
Drive development of next-generation materials for scalable quantum systems, including superconducting interconnect stacks and cryogenic-compatible dielectrics and bonding materials.
Contribute to APPC quantum packaging roadmap and capability build-out.
Track and evaluate emerging materials and integration schemes.
Generate material specifications and process guidelines, and integration documentation and characterization reports.
Communicate results to internal and external stakeholders.
Support IP generation, publications, and conference outputs.
Define materials strategy across multiple quantum platforms and customers.
Lead external technical engagements (e.g., R&D consortia, suppliers, quantum customers).
Mentor engineers and establish materials selection frameworks and best practices.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Take part in hiring of other Advanced Packaging team members in Singapore.
Mentor and guide new hires to assume their roles and responsibilities.
Other duties as assigned by manager.