Quantum IC Package Substrate Design Engineer

Intel Corporation•Hillsboro, OR

11d•$122,440 - $172,860•Onsite

About The Position

Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing.

Requirements

Excellent communication and presentation skills for technical and non-technical audiences
Strong analytical thinking and problem-solving capabilities
Collaborative mindset with ability to work effectively across diverse teams
Adaptability to work in a fast-paced, innovative research environment
Passion for pushing the boundaries of quantum technology development
B.S. degree in Electrical Engineering, Computer Engineering, or a related field AND 5+ years of experience in IC substrate design for CPU, GPU, SoC/ASIC, and/or relevant design architectures.
M.S. degree in Electrical Engineering, Computer Engineering, or a related field AND 3+ years of experience in IC substrate design for CPU, GPU, SoC/ASIC, and/or relevant design architectures.
Siemens Xpedition design environment and workflow.
High-speed signal routing.
Experience with large form factor IC substrates.

Nice To Haves

1+ years of experience with advanced routing engines for IC substrate design. Examples include AI and physics/model-based routing engines.
Proficiency with understanding SI/PI/thermal impact on IC substrate design choices.

Responsibilities

Design of IC substrates using Siemens Xpedition IC package design software
Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers
Deliver and disseminate design milestones to stakeholders
Design validation and verification; including DRC and LVS
Advanced packaging design integration (2.5D and 3D) with IC substrate
Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams
Communicate designs in presentations and relevant documentation
Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers