Quantum 3D Integration and Packaging Engineer

Applied Materials • Santa Clara, CA

1d • Onsite

About The Position

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of material science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology. At Applied’s CTO group, we focus on solid-state solutions for quantum technology, i.e. superconducting qubits and optical quantum computing. Our primary objective is to collaborate with system companies and universities to develop quantum devices with significantly lower error rates compared to current standards. Our approach centers on harnessing state of the art materials engineering and semiconductor processing, as well as our expertise in advanced (metasurface-based) optics to enhance device performance. To achieve this goal, we're seeking a passionate technologist with strong semiconductor and 3D integration background to develop advanced packaging solutions for emerging markets and new technology inflection on quantum information. We value our people and teams who turn possibilities into reality. We are deeply committed to fostering a Culture of Inclusion where every person knows they belong, feels empowered to bring their whole self to work, and is inspired to grow.

Requirements

• Doctorate Degree
• Demonstrates conceptual and practical expertise in own discipline and basic knowledge of related disciplines
• Has knowledge of best practices and how own area integrates with others; is aware of the competition and the factors that differentiate them in the market
• Acts as a resource for colleagues with less experience; may lead small projects with manageable risks and resource requirements
• Solves complex problems; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information
• Impacts a range of customer, operational, project or service activities within own team and other related teams; works within broad guidelines and policies
• Explains difficult or sensitive information; works to build consensus

Nice To Haves

• strong semiconductor and 3D integration background

Responsibilities

• Create 3D integration and packaging solutions for different platforms and quantum structures
• Work with advanced packaging, process, hardware, and metrology team to develop new materials, processes, and structures for quantum devices
• Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines
• Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues
• Generate internal and external documentation for products, presentations and technical reports
• Design and conduct experiment, measure material and device properties and interpret data
• Keep up to date with the latest advancements in 3D integration, quantum information, and related technologies to continually implement new technologies, enhance approaches, and develop methodologies
• Collaborate with customers, start-ups, or universities to identify key problems and develop enabling solutions
• Explore new growth area leveraging Applied’s expertise in precision material engineering

Benefits

• supportive work culture that encourages you to learn, develop, and grow your career
• comprehensive benefits package
• participation in a bonus and a stock award program, as applicable

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: Ph.D. or professional degree