Program Chief Engineer (Technical Lead)

SEAKR Engineering•Centennial, CO

7d•Onsite

About The Position

SEAKR Engineering is seeking an Electrical Engineer with fundamental knowledge of complex digital design utilizing microprocessors, ASICs, FPGAs, and various memory technologies. This role is responsible for developing new architectures, refining existing architectures, and developing requirements. The engineer will also be responsible for technical interfaces with customers and will lead a design team from initial specification through to hardware delivery, involving box, module, board, FPGA, and software level designs. This position champions program simulation, analysis, integration, and test. The role includes performing detailed reviews of other engineers' designs, approving engineering documents and drawings, and leading the program design team through hardware checkout and validation in a lab environment, as well as full system box integration and environmental testing. The engineer will provide technical oversight and coordinate efforts across multiple functional disciplines, working closely with Hardware, Logic, Mechanical, Software, Manufacturing, Test, and Systems Engineers to ensure designs meet customer requirements. This role supports the full program life-cycle, from ATP to delivery, including oversight of environmental testing (thermal cycle, thermal vacuum, vibration, and EMI/EMC). The Program Chief Engineer will lead the program team on all technical matters through major reviews such as SRR, PDR, CDR, MRR, TRR, PSR, etc., and contribute to detailed reviews of FPGA, software, and mechanical designs. Clear written and verbal communication skills are essential. Limited local travel may be required.

Requirements

A Bachelor's degree in Electrical or Computer Engineering is required.
Must have 8+ years of design experience.
Extensive knowledge of circuit design and signal integrity is expected.
Has led module debug and integration of module into system.
Familiar with environmental test methods and flow.
Understands and has performed worst case analysis.
Ability to effectively lead system integration and test of multiple digital boards, FPGA designs, and system software.
Ability to work effectively under pressure to meet tight deadlines.
Ability to provide leadership and support to less experienced engineers on a program team.
US Citizenship Required

Nice To Haves

Master's degree preferred.
Experience with digital and/or RF electronics design, schematic capture, FPGA design, embedded system design, single board computers, or embedded software design is desired.

Responsibilities

Developing new architectures, refining existing architectures, and developing requirements.
Technical interfaces with customers.
Lead a design team from initial specification through to hardware delivery involving box, module, board, FPGA, and software level designs.
Champion program simulation, analysis, integration, and test.
Perform detailed review of other engineer's designs in addition to approval of engineering and drawings.
Lead program design team through hardware checkout and validation in a lab environment, as well as work through full system box integration and environmental testing.
Digital board design which includes thorough design documentation, schematic capture and review of schematic, performing SI and PI analysis, creating and reviewing routing instructions, coordination of board layout, review of layout, documenting test plan and performing hardware verification and debug.
Perform hands-on debug of problems in lab with use of tools such as bench supplies, scopes and logic analyzers.
Oversee multiple module designs in a box system involving various levels of complexity, providing technical oversight to other design team members.
Provide technical oversight and coordinate efforts across multiple functional disciplines working closely with Hardware, Logic, Mechanical, Software, Manufacturing, Test and Systems Engineers to ensure designs meet customer requirements.
Support full program life-cycle, from ATP to delivery, which include oversight of environmental testing involving thermal cycle, thermal vacuum, vibration, and EMI/EMC.
Lead program team on all technical matters through major reviews such as SRR, PDR, CDR, MRR, TRR, PSR etc.
Contribute to detailed reviews of FPGA, software, and mechanical designs.