Foveros Direct Pathfinding Integration

Intel Corporation•Hillsboro, OR

2d•$105,650 - $172,860•Onsite

About The Position

As a Product Packaging Engineer, you will play a key role in developing Intel’s next-generation packaging solutions for semiconductor and electronic products. In this role, you will contribute to the design, development, qualification, and optimization of packaging technologies that support product performance, manufacturability, scalability, and sustainability. Working closely with cross-functional teams across engineering, manufacturing, supply chain, and quality organizations, you will help drive innovative packaging solutions that enable Intel to remain a leader in advanced semiconductor technology. This position offers the opportunity to combine technical expertise, problem-solving, and innovation to deliver impactful solutions on a global scale.

Requirements

Bachelor’s degree in Mechanical Engineering, Materials Science Engineering, Electrical Engineering, Physics, Chemistry, Optical Engineering, Polymer Science and Engineering, or a related technical field.
1+ years of relevant engineering experience with a Bachelor’s degree; OR a Master’s degree or PhD in Engineering or a related discipline with no prior experience required.

Nice To Haves

Proficiency in applying fundamental science and engineering concepts to develop innovative packaging solutions.
Demonstrated experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
Experience in semiconductor manufacturing and/or advanced packaging technologies.
Experience with packaging process development, assembly equipment, or manufacturing optimization.
Knowledge of reliability testing, failure analysis, and process qualification methods.
Experience working in high-volume manufacturing or technology development environments.
Strong collaboration and communication skills with cross-functional teams and external suppliers.

Responsibilities

Design, develop, and qualify packaging materials and solutions for semiconductor and electronic products.
Lead packaging development activities from concept and prototyping through qualification testing and manufacturing implementation.
Collaborate with cross-functional teams to ensure alignment with manufacturing, supply chain, logistics, quality, and regulatory requirements.
Develop and maintain packaging specifications, artwork, documentation, and bills of material (BOMs).
Drive process improvements focused on manufacturability, cost optimization, waste reduction, and sustainability initiatives.
Analyze thermal, mechanical, and electrical performance of packaging designs to ensure product reliability and compliance with specifications.
Troubleshoot packaging-related issues and develop innovative technical solutions for internal stakeholders and customers.
Establish and manage material specifications for suppliers and work closely with Quality Assurance and Procurement teams to ensure compliance with quality standards and vendor performance expectations.
Benchmark industry trends, emerging technologies, and best practices to identify opportunities for innovation and continuous improvement in packaging technologies.