Packaging SBU Product Line Management IV - (E4)
About The Position
The Applied Global Services (AGS) Packaging Service Business Unit (SBU) is seeking an ambitious candidate that possesses strong technical knowledge with Wafer level packaging semiconductor equipment in the areas of hardware design, process engineering and optimization, customer fab operations, as well as business acumen. This person will work closely with BU product development and field support, AGS operations, and AGS field service to ensure products have the documentation, spare part sourcing strategies, and maintenance capabilities required to be successful at customer sites. They will engage in early phases of the new product design cycle to ensure after-sale support planning is included from initial concept through final product release. An ideal candidate should have a strong technical knowledge of packaging equipment, demonstrated technical program management skills and possess strong communication skills. This is a strategic role and will suit someone who can drive growth partnering across the organization to identify and solve customer high vale problems.
Requirements
- Functional Knowledge Demonstrates depth and/or breadth of expertise in own specialized discipline or field.
- 3-5 years of Wafer Level Packaging / Application / Platform experience.
- Program Management proficiency.
- Skilled at Microsoft Office suite; esp. PowerPoint, Excel.
- Create material and present it executives / large groups.
- Business Expertise Interprets internal/external business challenges and recommends best practices to improve products, processes, or services.
- Has Semi-space awareness; Regions, customer, segments.
- Leadership May lead functional teams or projects with moderate resource requirements, risk, and/or complexity.
- Problem Solving Leads others to solve complex problems; uses sophisticated analytical thought to exercise judgement and identify innovative solutions.
- Solves unique and complex problems with broad impact on the business; requires conceptual and innovative thinking to develop solutions.
- Self-driving; able to negotiate progress around roadblocks; willing to ask for help and find support for developing solutions.
- Impact Impacts the achievements of customer, operational, project or service objectives; work is guided by functional policies.
- Interpersonal Skills Communicates difficult concepts and negotiates with others to adopt a different point of view.
- Able to lead and work within matrixed teams.
- Able to influence others and drive teams toward the right path / solution.
- Can present to small and large teams effectively.
- Qualifications Leads others to solve complex problems; uses sophisticated analytical thought to exercise judgment and identify innovative solutions.
- Minimum of a Bachelor's Degree required, preferably in Chemical, Mechanical, Electrical, Material Science, and/or Data Science.
- 7 - 10 Years Semiconductor industry experience (5+) years, preferably in Wafer Level Packaging related roles
Responsibilities
- Program Manage service product development from Initiation to Release
- Lead HVP (High Value Problem) discovery through VOC (Voice of Customer) & FSO.
- Propose and select appropriate solutions based on ROI estimates.
- Lead team to assess Market Opportunity and select beta sites.
- Chair regular Core Team meetings to drive design & development of proposed solutions through internal cross-functional teams (OCE, DT/AIx, FV, BU).
- Be accountable for successful beta demonstration by working with FSO, FSO Focals, AGS Focals responsible for the beta site.
- Drive creation of Marketing Collateral, Technical Procedures, and Field Training for sales and BD, CE’s and PSE’s that will support the service agreements enabled by the Service Product.
- Collaborate with AGS focal team to report on service revenue generated by the new Service Product vs. forecast.
- Prepare and Deliver MPR (Monthly Product Reviews) providing status updates and help needed to AGS executives throughout the Phase Gate release cycle.
- Closely work with Equipment BU PDP teams to co-develop and integrate AGS service products.
- Work with Business Unit on their NPIs (New Product Introductions) and Legacy tools to prepare and embed service product offerings.
- Spearhead AIx growth engine to develop new capability and enable service product offers.
- Interfaces with BU, FSO / PSE, and customer teams regarding technical requirements, analysis, schedule, deliverables, and closure.
- Collect validation data from demo sites, prepare summary reports and present these reports to SBU management.
- Service Readiness Accountable for driving the service readiness throughout the Product Life Cycle of Wafer Fab Equipment
- Support Internal and External documentations review for legacy and new products.
- Coordinate and implement Service Product Roadmap releases through program management process (Training, documentation, spares readiness, part repair, etc.).
- Drive/ influence tool design and tooling to protect company values and services.
- Participate in Design for Install & Design for Service programs.
- Works closely with business unit to introduce equipment special tooling.
Benefits
- supportive work culture that encourages you to learn, develop, and grow your career
- comprehensive benefits package
- participation in a bonus and a stock award program, as applicable
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What This Job Offers
Job Type
Full-time
Career Level
Senior
